lecture2 - MIT OpenCourseWare http:/ocw.mit.edu Spring 2008...

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MIT OpenCourseWare http://ocw.mit.edu 2.830J / 6.780J / ESD.63J Control of Manufacturing Processes (SMA 6303) Spring 2008 For information about citing these materials or our Terms of Use, visit: http://ocw.mit.edu/terms .
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Control of Manufacturing Processes Subject 2.830/6.780/ESD.63 Spring 2008 Lecture #2 Semiconductor Process Variation February 7, 2008 M anufacturing 1
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Agenda • The Semiconductor Fabrication Process – Manufacturing process control • Types of Variation in Microfabrication – Defects vs. parametric variations – Temporal variations: wafer to wafer (run to run) – Spatial variations: wafer, chip, and feature level • Preview of manufacturing control techniques – Statistical detection/analysis of variations – Characterization/modeling of processes & variation – Process optimization & robust design – Feedback control of process variation M anufacturing 2
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e m i c o n d u c t o r F a b r i c a t i o n P r o c e s s , P a r t 1 R . J . S h u t z , i n S t a t i s t i c a l C a s e S t u d i e s f o r I n d u s t r i a l P r o c e s s I m p r o v e m e n t , p p . 4 7 0 - 4 7 1 , S I A M , 1 9 9 7 . M a n u f a c t u r i n g C o u r t e s y o f t h e S o c i e t y f o r I n d u s t r i a l a n d A p p l i e d M a t h e m a t i c s . U s e d w i t h p e r m i s s i o n . 3
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This note was uploaded on 09/24/2010 for the course MECHE 2.830J taught by Professor Davidhardt during the Spring '08 term at MIT.

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lecture2 - MIT OpenCourseWare http:/ocw.mit.edu Spring 2008...

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