MIME 262 - Final Exam Review 1

MIME 262 - Final Exam Review 1 - Questions Regarding...

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Questions Regarding Microelectronics Packaging, Si Device Technology and other Engineering Structures Questions in this area will involve explaining any of the following: 1) operation of an engineering device, 2) materials selection for a specific engineering structure, 3) fabrication of microchips, 4) packaging of microchips. Discuss briefly at least four functions that an integrated circuit package has in connecting a Si device to the ‘outside world’. Highlight the importance of materials selection for these functions. Ball Grid Array Package – “Breakdown” the microelectronics package shown below by answering the following questions. a) Discuss the choice of materials for each component in terms of electrical properties ? b) Discuss the choice of materials for each component in terms of mechanical properties ? c) Discuss the choice of materials for each component in terms of thermal properties ? A ceramic material, ZrO
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This note was uploaded on 10/02/2010 for the course ENGINEERIN MIME 262 taught by Professor Chrimik during the Fall '10 term at McGill.

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MIME 262 - Final Exam Review 1 - Questions Regarding...

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