apmc10_balun_paper_ver3_2

apmc10_balun_paper_ver3_2 - Proceedings of Asia-Pacific...

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Proceedings of Asia-Pacific Microwave Conference 2010 Copyright 2010 IEICE Development of a Defected Ground Structure Wide Bandwidth Balun on Multilayer Organic Substrate Hai Ta #1 , Alexander Stameroff #2 , Anh-Vu Pham #3 # Department of Electrical and Computer Engineering, University of California, Davis Davis, California 95616, USA 1 [email protected] 2 [email protected] 3 [email protected] Abstract We present the design and development of a compact wide bandwidth balun on a multilayer organic substrate. A defected ground plane is designed into a multi- layered Marchand balun to achieve wide bandwidth. Our experimental results demonstrate that the balun achieves an average measured insertion loss of 0.5 dB from 1.9 GHz to 18 GHz and ~1dB from 18 GHz to 20 GHz and a return loss better than 10 dB from 1.9 GHz to 21.5GHz. The measured amplitude imbalance is less than ±1.4 dB from 1 GHz to 21.5 GHz. The measured phase imbalance is less than ±5 o from 1 GHz to 19 GHz. To the best of our knowledge, this planar balun has the largest bandwidth ratio reported to date. Index Terms — Marchand Balun, Wide bandwidth, Multilayer, Defected Ground Structure. I. INTRODUCTION Baluns are an important component for converting between balanced and unbalanced signals in communication circuits. They are widely used in RF/microwave circuits such as balanced mixers [1], push-pull amplifiers [2] and antenna feed networks. The Marchand topology [3] has been a popular approach for achieving wide bandwidth. A number of planar Marchand baluns has been reported in single-layer edge-coupled microstrip lines and multi-layered transmission lines. Single-layer baluns are easy to fabricate but tend to have smaller bandwidth ratios of approximately 2.7 [4]. Multi-layered baluns provide larger bandwidth ratios such as 5:1 [5], 3.5:1 [12] or 3.7:1 [13]. Many state-of-the-art microwave hybrid designs are complex with multi-layers. System integration is critical and a lot of research has been done to show that Liquid Crystal Polymer (LCP) is an ideal candidate for the integrated millimeter wave needs for the future. The benefit of LCP includes its low moisture absorption that can provide near hermetic packaging [14] in addition to the ability to have multiple layers on a homogeneous substrate. Customarily, multi-layer boards need an intermediate adhesion layer which makes the substrate media no longer homogeneous. LCP, however, is self adhesive, allowing for a homogenous substrate media, simplifying microwave designs. In this paper, we present the design and development of a
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This note was uploaded on 10/15/2010 for the course ECE EEC212 taught by Professor Hurst during the Fall '10 term at UC Davis.

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apmc10_balun_paper_ver3_2 - Proceedings of Asia-Pacific...

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