Unformatted text preview: An additional use of polyimide resin is as an insulating and passivation  layer in the manufacture of digital semiconductor and MEMS chips. The polyimide layers have good mechanical elongation and tensile strength, which also helps the adhesion between the polyimide layers or between polyimide layer and deposited metal layer. The minimum interaction between the gold film and the polyimide film, coupled with high temperature stability of the polyimide film, results in a system that provides reliable insulation when subjected to various types of environmental stresses....
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This note was uploaded on 10/16/2010 for the course MATSE 441 at Penn State.