D-Deposition - National Chiao-Tung University Department of...

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Deposition - 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 National Chiao-Tung University Department of Electronics Engineering & Institute of electronics 1 Thin Films for ICs Semiconductor Crystalline Si, poly-Si, SiGe Dielectric USG, BPSG, PSG, SOG Si 3 N 4 , SiON FSG, low k dielectric, high k dielectric, etc. Organic materials Photo-resist, low k dielectric Conductor Al, Al-Si, Al-Si-Cu, Al-Cu, Cu Ti, Co, Ni, W, WSi 2 TiN, TaN
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Deposition - 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 National Chiao-Tung University Department of Electronics Engineering & Institute of electronics 2 Deposition Techniques Epitaxy VPE, LPE, MBE Physical Vapor Deposition (PVD) evaporator, sputter, Long-Throw-Sputter, Ionized Metal Plasma, etc. Chemical Vapor Deposition (CVD) APCVD, SACVD, LPCVD, PECVD, HDPCVD, UHVCVD, MOCVD, photon-enhanced CVD, Jet Vapor Deposition (JVD), Atomic Layer Deposition (ALD), etc. Electro-chemical Deposition (ECD) electroplating, electroless plating Spin coating
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Deposition - 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 National Chiao-Tung University Department of Electronics Engineering & Institute of electronics 3 Source for Film Deposition Si deposition sources SiH 4 , SiH 2 Cl 2 , SiHCl 3 , SiCl 4 , H 2 Dielectric deposition sources oxide - SiH 4 , TEOS, O 2 , PH 3 , B 2 H 6 , AsH 3 , NF 3 , etc. nitride - SiH 4 , SiCl 4 , NH 3 , N 2 , etc. SOG/SOP - organic liquid source Metal deposition sources PVD - pure material target, compound target CVD - WF 6 (+SiH 4 ), TiCl 4 (+NH 3 , N 2 ), Al(C 4 H 9 ) 3 , Cu(hfac) 2 , etc. ECD - metal-contained solutions
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Deposition - 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 National Chiao-Tung University Department of Electronics Engineering & Institute of electronics 4 Applications of Film Deposition Semiconductor deposition Si epitaxy - bipolar device, some high performance or high power products, etc. poly-Si & a-Si - gate of MOS device, diffusion source, electrode of DRAM capacitor, TFT of SRAM & panel display, etc. SiGe - heterojunction device, gate electrode, strained layer, S/D contact, etc. Dielectric deposition undoped oxide - ILD, IMD, spacer, STI filling, etc. BPSG & PSG - planarization, gettering, etc. FSG - low K IMD Si 3 N 4 , & SiON - isolation, spacer, etch stop, Cu barrier, Self-aligned contact, dielectric of capacitor, anti-reflection coating, etc. SOG/SOP - planarization, low K IMD High K dielectric – dielectric of capacitor, gate insulator Low K dielectric - IMD
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Deposition - 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 National Chiao-Tung University Department of Electronics Engineering & Institute of electronics 5 Applications of Film Deposition Metal deposition Ti - silicide (TiSi 2 ), wetting layer of Al-plug Co - silicide (CoSi 2 ) Ni – silicide (NiSi)
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This note was uploaded on 10/18/2010 for the course EECS 216 taught by Professor Davewinn during the Spring '10 term at 카이스트, 한국과학기술원.

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D-Deposition - National Chiao-Tung University Department of...

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