F-Lithography - Lithography - 崔 崔 崔 崔 崔 崔 崔...

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Unformatted text preview: Lithography - 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 National Chiao-Tung University Department of Electronics Engineering & Institute of electronics 1 Lithography Technology Strategy • photolithography - source, lens, resist • electron-beam lithography - throughput, mask, cost • x-ray lithography - source, mask, resist, cost • ion-beam lithography - throughput, mask, cost Printing method • contact printing - defect, lifetime, resolution • proximity printing - defect, lifetime, resolution • projection printing • step and repeat - 10x, 5x, 4x, . . . . • scanning - wafer-scan, raster scan, stripe-scan, step-scan Lithography - 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 National Chiao-Tung University Department of Electronics Engineering & Institute of electronics 2 Pattern Transfer - I Adhesion promoter • HMDS (hexa-methylene-di-siloxane) spin-coating or vapor deposition Photo Resist (PR) spin-coating • 3000-6000 RPM for 1 um thick PR • With or without anti-reflecting layer Soft bake • 90-120 °C for 60-120 sec. Exposure Post exposure bake (PEB) • ~100 °C for 10 min. PR Develop Hard bake • 100-180 °C for 10-30 min. Etching & PR striping Lithography - 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 National Chiao-Tung University Department of Electronics Engineering & Institute of electronics 3 Pattern Transfer - II Liftoff technique • PR patterning • Film deposition • PR dissolve • Film liftoff Application • >1um IC technology • IC Packaging process • Compound semiconductor process • MEMS process • R&D Lithography - 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 National Chiao-Tung University Department of Electronics Engineering & Institute of electronics 4 Terms Definition Resolution • The minimum feature dimension that can be transferred with high fidelity to a resist film. Depth of Focus (DOF) Modulation Transfer Function (MTF) θ λ sin where , 1 n NA NA k R = = 2 2 sin 2 tan 2 NA k R R DOF = ± ≈ ± = min max min max I I I I MTF +-≡ Lithography - 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 崔 National Chiao-Tung University Department of Electronics Engineering & Institute of electronics 5 Terms Definition M 1 V1 M 2 M1 V1 M2 Registration (overlay) • The measure of how accurately patterns on successive masks can be aligned (overlaid) with respect to previously defined patterns. Source of overlay error • Reticle distortion, image field distortion, exposure tool alignment error, scanning or stepper error, wafer distortion....
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This note was uploaded on 10/18/2010 for the course EECS 216 taught by Professor Davewinn during the Spring '10 term at 카이스트, 한국과학기술원.

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F-Lithography - Lithography - 崔 崔 崔 崔 崔 崔 崔...

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