Lec12p.MechanicsOfMaterialsI

Lec12p.MechanicsOfMaterialsI - EE 245: Introduction to MEMS...

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1 EE 245: Introduction to MEMS Lecture 12: Mechanics of Materials CTN 10/5/09 Copyright © 2009 Regents of the University of California EE C245 : Introduction to MEMS Design LecM 6 C. Nguyen 9/28/07 34 Wafer Bonding EE C245 : Introduction to MEMS Design LecM 6 C. Nguyen 9/28/07 35 Fusion Bonding Two ultra-smooth (<1 nm roughness) wafers are bonded without adhesives or applied external forces Procedure : ª Prepare surfaces: must be smooth and particle-free ( 2 plasma, hydration, or HF dip ª When wafers are brought in contact at room temperature, get hydrogen bonding and/or van der Waals forces to hold them together ª Anneal at 600-1200 o C to bring the bond to full strength Result : a bond as strong as the silicon itself! Works for Si-to-Si bonding and Si-to-SiO 2 bonding Works for Si-to-Si bonding and Si-to-SiO 2 bonding Hydrate surfaces Contact and anneal Lap down the top wafer EE C245 : Introduction to MEMS Design LecM 6 C. Nguyen 9/28/07 36 Fusion Bonding Example Below : capacitive pressure sensor w/ fusion-bonded features
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Lec12p.MechanicsOfMaterialsI - EE 245: Introduction to MEMS...

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