PolyMUMPs.DR.v11

PolyMUMPs.DR.v11 - PolyMUMPs Design Handbook a MUMPs...

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PolyMUMPs Design Handbook a MUMPs® process Jim Carter, Allen Cowen, Busbee Hardy , Ramaswamy Mahadevan, Mark Stonefield, and Steve Wilcenski MEMSCAP Inc. Revision 11.0
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Copyright © 1992-2005 by MEMSCAP. All rights reserved. Permission to use and copy for internal, noncommercial purposes is hereby granted. Any distribution of this manual or associated layouts or any part thereof is strictly prohibited without prior written consent of MEMSCAP Inc. GDSII is a trademark of Calma, Valid, Cadence. L-Edit and Tanner Database are trademarks of Tanner Research Inc.
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Table of Contents Chapter 1: Three-Layer Polysilicon Surface Micromachining Process 1.1 Introduction . ...................................................................................................................................................................... 1 1.2 Process Overview. ............................................................................................................................................................. 2 Chapter 2: PolyMUMPs Design Guidelines and Rules 2.1 Introduction . .................................................................................................................................................................... 11 2.2 Design Rules. ................................................................................................................................................................... 12 2.3 Beyond the Design Rules. ................................................................................................................................................ 31 2.4 Film Parameters . ............................................................................................................................................................. 36 2.5 EZ-PolyMUMPs Design Rules. .......................................................................................................................................... 38 2.6 Layout Requirements . ..................................................................................................................................................... 38 2.7 Die Reservation and Layout Submission. ........................................................................................................................ 39 2.8 Custom Dicing, Releasing and Critical Point Drying. ...................................................................................................... 39 2.9 Other Reference Material. ............................................................................................................................................... 40
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3-LAYER POLYSILICON SURFACE MICROMACHINING PROCESS 1 PolyMUMPs Design Handbook, Rev. 11.0 Chapter 1 Three-Layer Polysilicon Surface Micromachining Process 1.1 Introduction The Multi-User MEMS Processes, or MUMPs ® , is a commercial program that provides cost-effective, proof-of- concept MEMS fabrication to industry, universities, and government worldwide. MEMSCAP offers three
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This note was uploaded on 10/31/2010 for the course C 218 taught by Professor Clarknguyen during the Fall '09 term at Berkeley.

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PolyMUMPs.DR.v11 - PolyMUMPs Design Handbook a MUMPs...

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