113D_1_113D_1_EE113D_exp_a

113D_1_113D_1_EE113D_exp_a - UCLA Electrical Engineering...

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Unformatted text preview: UCLA Electrical Engineering Professor Jain EE 113D TA Rick Huang Experiment A No report due. Purpose To gain familiarity with the software environment used to develop and test TMS320C54x code. Introduction The application development system for the TMS320C54x chip family which has been implemented in our lab consists of a modular board, the DSKPlus (DSP Starter's Kit Plus), two MS-DOS based programs: an assembler (DSKPLASM.EXE), an applications loader (LOADAPP.EXE), and a Windows 3.1 based debugger program (DSKPlus Explorer). These form the core package required for assembly language programming on the DSKPlus. In addition, there are other tools available which allow the compiling and linking of C source subroutines. We will discuss only the assembly language tools in this experiment. The source assembly le (created with a text editor, such as Notepad in Windows) is a sequence of TMS320C54x assembly code and stored with a ".asm" su x ( lename.asm). The assembler program (DSKPLASM.EXE) accepts this le as its input and produces an object le ( lename.obj). This is a machine code executable le which is speci c to the TMS320C54x chip and the DSKPlus memory map. The executable le can then be either downloaded to the chip onboard the DSKPlus board (using the host computer's parallel port connection and the LOADAPP.EXE command) or, the debugger program (C54x Code Explorer) can be started and the le loaded into the DSKPlus board from the "File Load" command menu. Upon downloading of the executable le to the DSP chip, it is automatically executed.menu....
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113D_1_113D_1_EE113D_exp_a - UCLA Electrical Engineering...

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