PROBLEM 4.28 KNOWN:Dimensions and surface temperatures of a square channel. Number of chips mounted on outer surface and chip thermal contact resistance. FIND:Heat dissipation per chip and chip temperature. SCHEMATIC:ASSUMPTIONS:(1) Steady state, (2) Approximately uniform channel inner and outer surface temperatures, (3) Two-dimensional conduction through channel wall (negligible end-wall effects), (4) Constant thermal conductivity. ANALYSIS:The total heat rate is determined by the two-dimensional conduction resistance of the channel wall, q = (T2– T1)/Rt,cond(2D), with the resistance determined by using Equation 4.21 with Case 1 of Table 4.1. For W/w = 1.6 > 1.4 1()()t,cond(2D)0.930 ln W / w0.0500.387R0.00160 K / W2L k20.160m 240 W / m Kππ−===⋅The heat rate per chip is then ()()()21ct,cond 2D5020CTTq156.3 WN R120 0.0016 K / W−°−===<and, with q
This is the end of the preview.
access the rest of the document.
As a current student on this bumpy collegiate pathway, I stumbled upon Course Hero, where I can find study resources for nearly all my courses, get online help from tutors 24/7, and even share my old projects, papers, and lecture notes with other students.
Temple University Fox School of Business ‘17, Course Hero Intern
I cannot even describe how much Course Hero helped me this summer. It’s truly become something I can always rely on and help me. In the end, I was not only able to survive summer classes, but I was able to thrive thanks to Course Hero.
University of Pennsylvania ‘17, Course Hero Intern
The ability to access any university’s resources through Course Hero proved invaluable in my case. I was behind on Tulane coursework and actually used UCLA’s materials to help me move forward and get everything together on time.