problem4-82 - PROBLEM 4.82 KNOWN Silicon chip mounted in a...

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PROBLEM 4.82 KNOWN: Silicon chip mounted in a dielectric substrate. One surface of system is convectively cooled, while the remaining surfaces are well insulated. See Problem 4.75. Use the finite-element oftware FEHT as your analysis tool. s FIND: (a) The temperature distribution in the substrate-chip system; does the maximum temperature exceed 85 ° C?; (b) Volumetric heating rate that will result in a maximum temperature of 85 ° C; and (c) Effect of reducing thickness of substrate from 12 to 6 mm, keeping all other dimensions unchanged with = 1 × 10 q ± 7 W/m 3 ; maximum temperature in the system for these conditions, and fraction of the ower generated within the chip removed by convection directly from the chip surface. p SCHEMATIC: ASSUMPTIONS: (1) Steady-state conditions, (2) Two-dimensional conduction in system, and (3) niform convection coefficient over upper surface. U ANALYSIS: Using FEHT , the symmetrical section is represented in the workspace as two connected regions, chip and substrate. Draw first the chip outline;
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This note was uploaded on 12/07/2010 for the course MAE Heat Trans taught by Professor Lee,j.s. during the Spring '10 term at Seoul National.

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problem4-82 - PROBLEM 4.82 KNOWN Silicon chip mounted in a...

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