L4 Fab2 - Fabrication Technology, Part II #! Agenda $!...

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1 Lecture 4 Fab 2 EEL 5225, Fall 2010, David Arnold Fabrication Technology, Part II ! Senturia, Ch. 3, pp. 42-50, 57-77, Ch. 4 pp. 79-98; “Overview Surface Micromachining”; “Overview LIGA”; “Overview Bulk Micromachining”; “Overview Wafer Bonding” " HW4 # Agenda $ Micromachining - Overview $ Surface Micromachining $ LIGA $ Bulk Micromachining $ Wafer Bonding $ MEMS Process Examples $ Packaging
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2 Lecture 4 Fab 2 EEL 5225, Fall 2010, David Arnold Micromachining – Overview % Micromachining % Specialized techniques for fabricating structures other than electronics % Key processes: Bulk Micro- machining Surface Micro- machining Wafer Bonding LIGA Suspended mass structure. Ristic, ed., Sensor Technology and Devices, p. 80. LIGA Microgear system Planar induction motor F. Cros, H. Koser, 2002.
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3 Lecture 4 Fab 2 EEL 5225, Fall 2010, David Arnold % Original Starting Substrate--Silicon % Mechanical % High modulus of elasticity - similar to steel % High tensile yield strength - stronger than steel % Essential perfect elasticity - no mechanical hysteresis % Low density - similar to aluminum % Electrical % Exhibits change in resistivity with applied stress % Discovered in 1954 by Smith at Bell Labs % Thermal % High thermal conductivity % Why predominantly silicon? % Dominant substrate for microfabrication of CMOS IC’s % Will discuss other types of substrates later Micromachining – Overview
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4 Lecture 4 Fab 2 EEL 5225, Fall 2010, David Arnold Ref. K. E. Petersen, “Silicon as a Mechanical Material,” Proc. IEEE 70, pp. 420-457, 1982. Mechanical Properties of Silicon
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5 Lecture 4 Fab 2 EEL 5225, Fall 2010, David Arnold Surface Micromachining % Overview % Standard Polysilicon Surface Micromachining % Variations % Materials Considerations Surface Micro- machining
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6 Lecture 4 Fab 2 EEL 5225, Fall 2010, David Arnold Basic process sequence 2. Pattern holes in sacrificial layer - Mechanical anchor points - Electrical contacts to substrate Si 3. Deposit structural layer Poly-Si 1. Deposit sacrificial layer Oxide Si Surface Micromachining
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7 Lecture 4 Fab 2 EEL 5225, Fall 2010, David Arnold 4. Pattern the microstructure 5. Remove sacrificial layer, or “release” Surface Micromachining X. Steps 1-4 can be repeated to build up multiple layers
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8 Lecture 4 Fab 2 EEL 5225, Fall 2010, David Arnold % Hinged polysilicon Ref. Madou, Fund. of Microfabrication, p. 244-245. Example: Hinged Polysilicon Ref: Sandia MEMS Introductory Short Course Notes
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9 Lecture 4 Fab 2 EEL 5225, Fall 2010, David Arnold Ref. Kovacs, Micromachined Transducers Sourcebook, p. 139. Example: Sealed Cavities & Membranes % Processes % Thin film layer % Reactive growth sealing % Applications % Pressure sensors % Vacuum packaging
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10 Lecture 4 Fab 2 EEL 5225, Fall 2010, David Arnold Example: Rotors/Gears Ref: Sandia MEMS Introductory Short Course Notes
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11 Lecture 4 Fab 2 EEL 5225, Fall 2010, David Arnold % MEMSCap MUMPs % “M ulti-U ser M EMS P rocesses” % PolyMUMPs % 3-layer poly Surface Micromachining – Foundry Processes
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This note was uploaded on 01/17/2011 for the course EEL 5225 taught by Professor Arnold during the Fall '08 term at University of Florida.

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L4 Fab2 - Fabrication Technology, Part II #! Agenda $!...

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