ECE422_lectures - Acknowledgments These course notes were...

Info iconThis preview shows pages 1–3. Sign up to view the full content.

View Full Document Right Arrow Icon
Page 1 EE 422/522 Lecture Notes for ECE 422 / EE 522 Fall 2010 Karti Mayaram Oregon State State University Page 2 EE 422/522 Acknowledgments These course notes were originally developed by me for EE476 in Fall 1996 at Washington State University (WSU). The material in these notes has been derived from several sources. These include Dr. Venu Gopinathan's course notes from Columbia University, Dr. David Rich's analog IC design course notes, Prof. Terri Fiez's EE476 course notes, and Prof. Paul Gray's EE240 lecture notes. Their contributions to these notes are gratefully acknowledged. Also a significant amount of the material is based on the Gray and Meyer textbook. Prof. George La Rue at WSU made a monumental effort in cleaning up and formatting the original hand written notes in MS-WORD. I thank him for this effort and for providing me with the formatted notes. This version of the course notes is directly from him and includes his additions and my recent modifications. Karti Mayaram Page 3 EE 422/522 IC Technologies CMOS Si Bipolar BiCMOS GaAs (E/D MESFET & HFET) InP Heterojunction Bipolar SiGe Bipolar and BiCMOS Applications Telecommunications Optical Wireless DSL Computing Applications A/Ds and D/As Audio including voice Displays Disk drives and CDROMs Sensors and Actuators Automotive Engine control Displays Anticollision systems Airbags Biomedical Pacemakers Hearing aids Page 4 EE 422/522 Analog Circuit Hierarchy Device Technology CMOS, bipolar, GaAs MESFET, HBT Basic Circuits Amplifiers Current mirrors Buffers Functional blocks Operational Amplifiers A/D converters, D/A converters Voltage controlled oscillators Mixers Comparators Phase lock loops Voltage references Filters Subsystems Modulators and Demodulators Optical and wireless transceivers DSL and LAN modems Systems Cellular phones Disk and CD ROM drives Modems Measurement instruments Automobile air bag
Background image of page 1

Info iconThis preview has intentionally blurred sections. Sign up to view the full version.

View Full DocumentRight Arrow Icon
Advantages of single-chip implementation 1) Reduced system size – cell phones, hearing aids. 2) Increased speed – no parasitic capacitances from pins and interconnect 3) Reduced power dissipation – fewer off chip drivers required 4) Increased reliability – fewer packages, fewer interconnects and fewer bond wires (connections are most unreliable) 5) Reduced cost – smaller and simpler printed circuit boards, fewer packages (It costs about $10,000 per kg to launch a satellite) Disadvantages Integrating digital and analog components on same chip may increase design time and number of iterations due to noise coupling Other technologies may offer improved performance For instance, InP low noise amplifiers have lower noise figure than other technologies and may set the performance level for the whole system. Page 5 EE 422/522 MOSFET Operation Simplified (Fluid Dynamics Analog) V T = turn-on Voltage (threshold voltage) 1) Cut off: V GS < V T , V DS = 0 2) Strong Inversion: V GS > V T , V DS = 0 3) Non-saturation: V GS > V T , 0 < V DS < V G - V T 4) Saturation: V GS > V T , 0 < V DS > V G - V T Flow becomes independent of V DS S D G N+ N+ S D G N+ N+ S D G N+ N+ S D G N+ N+ Source Tank Gate Drain Tank V T V GS V T V GS V T
Background image of page 2
Image of page 3
This is the end of the preview. Sign up to access the rest of the document.

This note was uploaded on 01/18/2011 for the course ALS 161 taught by Professor Sfuiaf during the Spring '10 term at American InterContinental University Los Angeles.

Page1 / 53

ECE422_lectures - Acknowledgments These course notes were...

This preview shows document pages 1 - 3. Sign up to view the full document.

View Full Document Right Arrow Icon
Ask a homework question - tutors are online