115C_1_ee115c_16_17

115C_1_ee115c_16_17 - Wires 1 Modern Interconnect 3 primary...

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1 Wires
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2 Modern Interconnect 3 primary interconnect characteristics: Capacitance Resistance Inductance
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3 Capacitance Relationship between charge and voltage Simple equation (C = ε *area/distance) doesn’t apply any more. 2 or 3D field solvers to solve the capacitance between each conductor. Create a big table for all possible configurations Capacitance Extraction For every segment of each wire, look up from the table.
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4 From: Bakoglu89 Impact of Interwire Capacitance Capacitance is actually dominated by interwire capacitance within a layer. Between layer separation can be ~1um. Within layer separation can be <0.2um. width/thickness of metals are <<1
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5 Examples of Permittivity ( ε ) SiO 2 has very good permittivity. Can’t reduce capacitance much more than a factor of 3. Higher permittivity materials are used for gate oxide.
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6 Resistance W L H R = ρ H W L Sheet Resistance R 0 R 1 R 2 =
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7 Examples of Resistivity Typical material for wires is Aluminum Cu is used for higher level metals Resistance improvement is <2x Poly and diffusion can be used as interconnect Poly has ~100 Ω /square Diffusion has ~300 Ω /square Reduce resistance to 5 Ω /square by using Al- Oxide (Silicide) Contacts between layers are typically Tungsten and also has resistance. Textbook, pg. 145
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8 Inductance When signal is coupled to a ground plane, the current loop has an inductance. Approximate equation of a trace on a plane can be estimated. Too complex for simple equations and are part of field solvers. Inductance is more apparent for upper layer metals Lower resistance and bigger current loop.
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This note was uploaded on 02/09/2011 for the course EE 115C taught by Professor N/a during the Spring '10 term at UCLA.

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115C_1_ee115c_16_17 - Wires 1 Modern Interconnect 3 primary...

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