Week-10-Metallization-I

Week-10-Metallization-I - EE 504L Solid State and...

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EE – 504L Solid State and Integrated Circuit Processing Dr. Kian Kaviani sieh Ming Electrical Engineering Hsieh Ming Electrical Engineering Dept. University of Southern California Viterbi School of Engineering 1/3/2011 Dr. Kian Kaviani - Spring 2011 - EE504L 1
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Metallization in IC Industry 1/3/2011 Dr. Kian Kaviani - Spring 2011 - EE504L 2
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Applications of Metallization in IC Industry Ohmic Contacts (more than 2 Billions of em in a Pentium microprocessor chip) them in a Pentium – 4 microprocessor chip) Schottky Contact (mostly in compound emiconductors as a replacement for the semiconductors as a replacement for the MOS structure, up to million of them in an state-of-the-art GaAs – based IC) Interconnects (Most commonly used application with many feet of them in a multi layer chip) 1/3/2011 Dr. Kian Kaviani - Spring 2011 - EE504L 3
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terconnects Interconnects •S peed and functional – density of Ics are limited by the interconnects. There are four limitations that interconnects can impose: 1. The minimum chip area can become interconnect – limited 2. The speed performance can be constrained by interconnects 3. The side-by-side capacitance –component dominated
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This note was uploaded on 02/23/2011 for the course EE 474 taught by Professor Lingo during the Spring '11 term at USC.

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Week-10-Metallization-I - EE 504L Solid State and...

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