Week-11-etching

Week-11-etching - EE 504L Microelectronic Processing Microelectronic Processing Dr Kian Kaviani Hsieh Ming Electrical Engineering Ming Electrical

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EE- 504L Microelectronic Processing Dr. Kian Kaviani sieh Ming Electrical Engineering Hsieh Ming Electrical Engineering Dept. University of Southern California Viterbi School Of Engineering 1/3/2011 Dr. Kian Kaviani - Spring 2011 EE504L 1
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tching of Semiconductors Etching of Semiconductors 1/3/2011 Dr. Kian Kaviani - Spring 2011 EE504L 2
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Introduction What is Etching? All techniques by which material can be uniformly removed from a wafer and results in a delineation f a pattern of microcircuit of a pattern of microcircuit ow many types of etching modes exist? How many types of etching modes exist? There are two types of etching modes: 1. Wet Etching 2. Dry Etching 1/3/2011 Dr. Kian Kaviani - Spring 2011 EE504L 3
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erminology of Etching Terminology of Etching tch Rate 1. Etch Rate 2. Etch Rate Uniformity 3. Etch Profile (Isotropic vs. anisotropic) 4. Selectivity 5. Etch Bias 1/3/2011 Dr. Kian Kaviani - Spring 2011 EE504L 4
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tch Rate Etch Rate he rate at which the material is removed The rate at which the material is removed from the film by an etch process. 1/3/2011 Dr. Kian Kaviani - Spring 2011 EE504L 5
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tch Rate Uniformity Etch Rate Uniformity measure of the ability of an etch A measure of the ability of an etch process to etch evenly. The uniformity of e etch process is expressed for three the etch process is expressed for three conditions: ithin a Wafer 1. Within a Wafer 2. Wafer – to – Wafer 3. Run – to – Run 1/3/2011 Dr. Kian Kaviani - Spring 2011 EE504L 6
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tch Profile Etch Profile • In the process of transferring the mask pattern precisely to the film being etched, a also create a vertical edge profile. There are two possible scenario for this vertical profile 1/3/2011 Dr. Kian Kaviani - Spring 2011 EE504L 7
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electivity Selectivity Three kinds of materials are involved in an etch – process: 1. The photoresist mask he film being etched 2. The film being etched 3. The material under the film being etched During an etch process,all three will be attacked. The difference in the etch rate of these materials haracterizes the electivity characterizes the selectivity . Selectivity indicates how much faster one material etches than another under the same etch condition. 1/3/2011 Dr. Kian Kaviani - Spring 2011 EE504L 8
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electivity Selectivity • Two selectivity – parameters are of importance in IC tching processes: etching processes: • Selectivity with respect to the substrate (S s ) • Selectivity with respect to the masking material (S m ) •H i gh selectivity of both types are needed in most
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This note was uploaded on 02/23/2011 for the course EE 474 taught by Professor Lingo during the Spring '11 term at USC.

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Week-11-etching - EE 504L Microelectronic Processing Microelectronic Processing Dr Kian Kaviani Hsieh Ming Electrical Engineering Ming Electrical

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