Week-16-Testing-assembly

Week-16-Testing-assembly - EE-504L :Solid State Processing...

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EE-504L :Solid State Processing and Integrated Circuit Laboratory Dr. Kian Kaviani sieh Ming Electrical Engineering Hsieh Ming Electrical Engineering Dept. USC Viterbi School Of Engineering 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 1
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Testing Packaging & Assembly in Industry IC Industry 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 2
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Testing IC Testing 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 3
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IC Testing Philosophy of testing in IC industry: 1. Testing helps monitor the effectiveness of each rocess tep process – step. 2. Testing identifies “good” (functional & reliable) Ics as well as those that are “bad” 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 4
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IC Testing • It is extremely important to to identify a defective IC in the early stags of its manufacturing. The cost of detecting and perhaps replacing a defective part increases dramatically at each stage of manufacturing an electronic system. 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 5
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IC Testing Five stages of Testing of ICs: 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 6
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pecial Test Structures Special Test Structures 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 7
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ypes of Measurements Types of Measurements xamples of types of measurements made during Examples of types of measurements made during the final parametric test include: • Gate oxide breakdown voltage • Drain – to – substrate breakdown voltage • Drain – current for 0 V •On – resistance of the gate g • MOSFET Transconductance at a specified operating – voltage • Continuity and bridging in serpentine structures over oxide teps steps. • Contact resistance of the contact hole and via strings • The capacitance of the array structures containing insulator aterial and gate xide films 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 8 material and gate –oxide films
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utomatic Parametric Tests Automatic Parametric Tests 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 9
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robe Cards Probe Cards 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 10
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robe Cards Probe Cards 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 11
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Wafer Sort 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 12
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Assembly & Packaging for ULSI ( back end processes ) 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 13
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Wafer Preparation for Sawing Wafer Mounting 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 14
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Wafer Sawing 1/3/2011 Dr. Kian Kaviani Spring 2011 EE504L 15
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Week-16-Testing-assembly - EE-504L :Solid State Processing...

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