P04 - Low Weight Ductile Translucent Low Melting Temp. High...

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Bonding Bonding is an energy lowering process Material Properties: Metals Ceramics Polymers Composites Metallic Bonding Characteristics 1.) Delocalized electrons (valence electrons) 2.) Nucleus and inner core are held together by delocalized electron cloud 3.) Conduction electrons accelerated be electric field 4.) Atoms (or positive ions) are spherical , therefore, no covalence 5.) No directional bonding constraints 6.) Coordination Number determined by size of ions - also determines “Extensive” solid solution formation; Alloying Opaque Cheap Low Strength
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Unformatted text preview: Low Weight Ductile Translucent Low Melting Temp. High Strength Tough Transparent Easy to form (Sheets, Fibers, Film) Properties cannot be achieved by a single type of material Conductors of electricity and heat Refractory More Expensive Raw Materials Brittle Insulators of electricity and heat 7.) Clean surfaces can be welded together by contact (lack of directional bonding) 8.) As covalence increases with the number of near neighbors fixed, ductility decreases and coordination number is controlled by bond type not size...
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This note was uploaded on 03/21/2011 for the course CHE 332 taught by Professor Gregory during the Spring '11 term at Rhode Island.

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P04 - Low Weight Ductile Translucent Low Melting Temp. High...

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