IE 370 quiz 6 - IE 370 Quiz 6 (20 mins) Name: George Karaan...

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IE 370 Quiz 6 (20 mins) Name: George Karaan 1. What are some of the important design functions of IC packaging? (name two) (i) Through hole mounting, also called pin in hole (PIH) technology – IC package and other components have leads inserted through holes in PCB and soldered on underside (ii) Surface mount technology (SMT) – Components are attached to surface of board (in some cases, both top and bottom surfaces) 2. The surface of a silicon wafer is thermally oxidized, resulting in a SiO 2 film that is a thick. If the starting thickness of the wafer was b , what is the final wafer thickness? The final wafer thickness would be a + b. 3. Briefly explain the advantages and disadvantages of contact printing, proximity printing, and project printing, respectively. Contact Printing • Advantage: high resolution of the pattern onto wafer surface • Disadvantage: physical contact with wafers gradually wears out mask Proximity Printing • Advantage: eliminates mask wear • Disadvantage: image resolution is slightly reduced
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This note was uploaded on 05/05/2011 for the course IE 370 taught by Professor Chunghorng,r during the Spring '08 term at Purdue University.

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IE 370 quiz 6 - IE 370 Quiz 6 (20 mins) Name: George Karaan...

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