Unformatted text preview: 2. nontraditional machining (NTM) Understand the process conditions --- the energy carrier, working media, and energy conversion of each NTM process. The applicability, disadvantage and advantages of each NTM processes. Physical process mechanism of AWJM, EDM, ECM, Laser beam machining, plasma arc machining. 4. IC fabrication Processing Sequence for Silicon-based ICs (three major steps) Lithography: purpose, types (in terms of energy source, and process setup). IC fabrication: add, alter, and remove selected regions. Thermal oxidation – adds SiO2 layer on Si substrate Chemical vapor deposition- adds various layers Metallization processes- adds metal layers for electrical conduction Diffusion and ion implantation- alters chemistry of an existing layer or substrate Etching processes- removes portions of layers to achieve desired IC details Functions of IC packaging....
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This note was uploaded on 05/05/2011 for the course IE 370 taught by Professor Chunghorng,r during the Spring '08 term at Purdue.
- Spring '08