Quiz6 - IE 370 Quiz 6 (20 mins) Name: 1. What are some of...

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IE 370 Quiz 6 (20 mins) Name: 1. What are some of the important design functions of IC packaging? (name two) Ans: To connect the IC to the outside world and protect it from damage. 2. The surface of a silicon wafer is thermally oxidized, resulting in a SiO 2 film that is a thick. If the starting thickness of the wafer was b , what is the final wafer thickness? Ans: Final wafer thickness is b-0.44a. Total thickness of wafer + film is b+0.56a 3. Compare the pattering resolution of a) Electron lithography, b) X-ray lithography, and c) Ion lithography, d) Photolithography. Briefly explain why. Ans: As the conventional photolithography becomes increasingly inadequate, other lithography techniques that offer higher resolution are growing in importance. a) Electron lithography: This virtually eliminates diffraction during exposure of the resist, thus permitting higher resolution of the image. b)X-ray lithography: As in e-beam lithography, the wavelengths of x rays are much shorter than UV light . Thus they hold the promise of sharper imaging during exposure of
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Quiz6 - IE 370 Quiz 6 (20 mins) Name: 1. What are some of...

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