Use of heat pipe-heat sink for thermal management of high performance CPUs

Use of heat pipe-heat sink for thermal management of high performance CPUs

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Use of heat pipe/heat sink for thermal managenlent of high performance CPUs ABSTRACT Tliang Nguyen, Masataka Mochizuki, Koichi Mashiko, Yuji Saito Fujikiira Ltd 1-5- I, Kiba, Koto-Ku, ’Tokyo 135, Japan Tel +8 1-3-5606- 1 174 Fax +8 1-3-5606 I5 14 and Ioan Saucjuc Fiijikura Amei-ica lnc 300 1 Oaktnead Village Drive Santa Clara, CA 9505 1-08 I 1 USA This paper will describe various cooling solutions in notebook PC and desktopiserver applications. In the notebook PC application, miniature heat pipes of diameter 3-6 mm, flatten to desire thickness, are commonly used to improve heat spreading and more eficient transfer heat generated from the CPU to a remote heat dissipation area. Examples of three typical thermal solutions notebook PC are given in this paper. Whereas in the desktop server application, a flat type rectangular heat pipes or a so-called vapor chambers are used to attach under the base of the heat sink to help temperature uniformity across the heat sink base This will reduce the spreading resistance the heat sink base and therefore improve the heat sink performance. Experimental results showed that with a vapor chamber installed, can achieved a 4?00 improvement in the heat sink performance fix heat sink of length 1 IO mm. width 72.5 nim, height 50 mm and base thickness 7 mni. INTRODUCTION In the demand for closing the performance gap between desktop and notebook computer. more and more power performance processors had been developed for use in notebook. The drawback in the higher performance processor is that they have larger heat generation. This creates a challenge in providing thermal solution in notebook since high performance processor and additional features such as more Cache. more DRAM, larger HDD; PCMClA and CD-ROM leads to higher total power dissipation in notebook. it is even more challenge to provide the thermal solution 0-7803-5916-W00/$10.00 a2000 IEEE 76 m’ithout compromising the notebook’s size and weight Fortunately, heat pipe emerges as the most appropriate technology and cost effective thermal solution due to its excellent heat transfer capability. high efficiency and its structure simplicity. In this paper, we will review three thermal solutions for notebook application. The first thermal solution showed heat pipe used to spreading the heat generated from the CPU to an aluminum plate on the backside of the keyboard or on the chassis of the notebook. Second is a hinged heat pipe system that has heat pipe to transfer heat via the hinge of the notebook to the backside of the display panel. Third is a remote heat exchanger- (RHE) system where heat pipe is used to transfer heat to a miniature fin heat sink that incorporated a fan for air cooling. . In the first two cases, the thermal solutions are passive where cooling is by means of air natural convection, whereas, in the last case it is an active thermal solution where air forced through the heat sink for cooling.
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Use of heat pipe-heat sink for thermal management of high performance CPUs

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