MEMS_3FabricationM06 - Wright State University EE480/680...

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1 1 EE 480/680, Summer 2006, WSU, L. Starman MicroElectroMechanical Systems (MEMS) Wright State University Wright State University EE480/680 Micro-Electro-Mechanical Systems (MEMS) Summer 2006 LaVern Starman, Ph.D. Assistant Professor Dept. of Electrical and Computer Engineering Email: [email protected] 2 EE 480/680, Summer 2006, WSU, L. Starman MicroElectroMechanical Systems (MEMS) Fabrication Fabrication Spin-coating photoresist onto a wafer Help ! 3 EE 480/680, Summer 2006, WSU, L. Starman MicroElectroMechanical Systems (MEMS) MEMS Fabrication Micromachining consists of four separate areas: • Substrates and Dopants – Starting point • Patterning - Lithography • Additive Processes - Deposition • Subtractive Process - Etching Combining Lithography with • Substrates and Dopants • Additive Processes • Subtractive Process Results in Micromachining!! 4 EE 480/680, Summer 2006, WSU, L. Starman MicroElectroMechanical Systems (MEMS) MEMS Fabrication Micromachining combines Lithography , Thin Film Processing , and Sacrificial Etching to form mechanical devices Three Types of Fabrication Processes • Surface Micromachining • Bulk Micromachining • Microforming
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2 5 EE 480/680, Summer 2006, WSU, L. Starman MicroElectroMechanical Systems (MEMS) MEMS Fabrication Substrate Surface micromachining Microforming Bulk Micromachining 6 EE 480/680, Summer 2006, WSU, L. Starman MicroElectroMechanical Systems (MEMS) Overview Overview • Materials • Microelectronics Fabrication • Bulk Micromachining • Surface Micromachining • Micromolding • Packaging 7 EE 480/680, Summer 2006, WSU, L. Starman MicroElectroMechanical Systems (MEMS) Why Silicon Processing? 1) Abundant and Inexpensive 2) Billions invested in developing pure wafers and Silicon processing 3) Native Oxide with good electrical properties 8 EE 480/680, Summer 2006, WSU, L. Starman MicroElectroMechanical Systems (MEMS) Materials Materials Traditionally, MEMS have been fabricated using the same materials used in silicon (Si) based microelectronics - this is what we will concentrate on. • Crystalline Si • Polycrystalline Si (polysilicon) • Oxides of Si • Polycrystalline or Amorphous Dielectric Layers • Metal Films Addison Engineering
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3 9 EE 480/680, Summer 2006, WSU, L. Starman MicroElectroMechanical Systems (MEMS) Materials Materials • Si crystal structure • Diamond, or equivalently, two interpenetrating FCC lattices by a/4 along <111> “a” is the lattice constant, for Si, a = 5.43 Å at 300 K a a a 10 EE 480/680, Summer 2006, WSU, L. Starman MicroElectroMechanical Systems (MEMS) Materials Materials • Miller Indices • Specific plane (hkl), set of equivalent planes {hkl} • Specific direction [hkl] parallel to normal of plane (hkl), set of equivalent directions <hkl> x (a) y (b) z (c) (111) = 1/1, 1/1, 1/1 (100) = 1/1, 1/ ,1/ 11 EE 480/680, Summer 2006, WSU, L. Starman MicroElectroMechanical Systems (MEMS) Materials: Properties Materials: Properties Kovacs, Micromachined Transducers Sourcebook , 1998 12 EE 480/680, Summer 2006, WSU, L. Starman MicroElectroMechanical Systems (MEMS) Materials: Properties Gardner, Microsensors , 1994.
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4 13 EE 480/680, Summer 2006, WSU, L. Starman
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This note was uploaded on 05/18/2011 for the course ELECTRICA 067 taught by Professor Lavernstarman during the Spring '11 term at Wright State.

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MEMS_3FabricationM06 - Wright State University EE480/680...

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