introMEMS+Franck CHOLLET, Haobing LIU

introMEMS+Franck CHOLLET, Haobing LIU - A (not so) short...

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Unformatted text preview: A (not so) short introduction to MEMS Franck CHOLLET, Haobing LIU FEMTO-ST Institute, Université de Franche-Comté, France Please note that this work is published under a : Attribution-NonCommercial 2.5 You are free: to copy, distribute, display, and perform the work to make derivative works Under the following conditions: Attribution. Please attribute this work using: “A (not so) short Introduc- tion to Micro Electromechanical Systems”, F. Chollet, HB. Liu, version 4.0, 2010, < http://memscyclopedia.org/introMEMS.html > . Noncommercial. You may not use this work for commercial purposes. For any reuse or distribution, you must make clear to others the license terms of this work. Any of these conditions can be waived if you get permission from the copyright holder. Your fair use and other rights are in no way affected by the above. This is a human-readable summary of the Legal Code ( http://creativecommons.org/licenses/by-nc/2.5/legalcode ). Contents Contents 3 1 Why MEMS? 5 1.1 What is MEMS and comparison with microelectronics . . . . . 5 1.2 Why MEMS technology . . . . . . . . . . . . . . . . . . . . . 6 1.2.1 Advantages offered . . . . . . . . . . . . . . . . . . . . 6 1.2.2 Diverse products and markets . . . . . . . . . . . . . . 7 1.2.3 Economy of MEMS manufacturing and applications . . 9 1.3 Major drivers for MEMS technology . . . . . . . . . . . . . . . 11 1.4 Mutual benefits between MEMS and microelectronics . . . . . 13 2 Introduction to MEMS design 15 2.1 Physical scaling laws . . . . . . . . . . . . . . . . . . . . . . . 15 2.2 The principles of design and reliability . . . . . . . . . . . . . 18 2.3 MEMS design tools . . . . . . . . . . . . . . . . . . . . . . . . 21 3 How MEMS are made 23 3.1 Overview of MEMS fabrication process . . . . . . . . . . . . . 23 3.2 The MEMS materials . . . . . . . . . . . . . . . . . . . . . . . 27 3.3 Bulk micromachining, wet and dry etching . . . . . . . . . . . 29 3.3.1 Isotropic and anisotropic wet etching . . . . . . . . . . 29 3.3.2 Dry etching . . . . . . . . . . . . . . . . . . . . . . . . 36 3.3.3 Wafer bonding . . . . . . . . . . . . . . . . . . . . . . 37 3.4 Surface micromachining and thin-films . . . . . . . . . . . . . 39 3.4.1 Thin-film fabrication . . . . . . . . . . . . . . . . . . . 40 3.4.2 Design limitation . . . . . . . . . . . . . . . . . . . . . 56 3.4.3 Microstructure release . . . . . . . . . . . . . . . . . . 58 3.5 DRIE micromachining . . . . . . . . . . . . . . . . . . . . . . 60 3.6 Other microfabrication techniques . . . . . . . . . . . . . . . . 64 3.6.1 Micro-molding and LIGA . . . . . . . . . . . . . . . . 64 3.6.2 Polymer MEMS . . . . . . . . . . . . . . . . . . . . . . 64 3 3.7 Problems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 4 MEMS technology 67 4.1 MEMS system partitioning . . . . . . . . . . . . . . . . . . . . 67 4.2 Passive structures . . . . . . . . . . . . . . . . . . . . . . . . . 69 4.2.1 Mechanical structures . . . . . . . . . . . . . . . . . . 69....
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This note was uploaded on 05/20/2011 for the course MFA 12 taught by Professor Chen during the Spring '11 term at Uni. Oslo.

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introMEMS+Franck CHOLLET, Haobing LIU - A (not so) short...

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