UF-3701_Board_Construction_Guide - University of Florida...

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University of Florida EEL 3701 Dr. Eric M. Schwartz, Dr. Herman Lam Revision 0 18-Aug-10 Page 1/3 UF-3701 Board Construction Guide Soldering and Part Placement See the Chapter 3 of the MIT 6270 Manual for information on electronic assembly, including soldering techniques and component mounting. Construction Information All solder connections are through-hole, which means that the components go through the small holes and are soldered on the reverse side. Practice soldering before soldering the parts onto your board. Make sure to solder the resistors and capacitors flush to the board, as shown in Figure 2. Make sure to solder all of the headers flush to the board, as shown in Figure 3. Notice that all components are place on top of the board EXCEPT the SINGLE ROW HEADERS (see Figures 1, 4 and 5) . Do not directly touch the solder to the iron; instead, indirectly melt the solder through the lead of component. Figure 1 shows a fully constructed board from the top, Figure 4 shows one from the side and Figure 5 shows one from the bottom. Never rest the soldering iron on the bench top. Instead, always use the soldering iron holder. When you are done soldering, cover the soldering iron tip in solder. This will prevent tip oxidation and will lengthen the life of the soldering iron tip. Figure 1: Picture of assembled board. Parts are on top. (Top is defined as the labeled surface.) Figure 3: Header placement. Figure 2:
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UF-3701_Board_Construction_Guide - University of Florida...

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