btechece4 - B.TECH. (Electronics and Communication...

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B.TECH. (Electronics and Communication Engineering) Batch 2006 SCHEME OF PAPERS 7th SEMESTER (Electronics and Communication Engineering ) Industrial Training (Project)
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B.TECH. (Electronics and Communication Engineering) SCHEME OF PAPERS Batch 2006 8 th SEMESTER (Electronics and Communication Engineering) Code T ITLE OF P APER M AXIMUM M ARKS T OTAL M ARKS T IME A LLOWED (H RS .) LOAD L T P I NTERNAL A SSESSMENT U NIVERSITY E XAM . ECE 401 Microwave Engineering 50 50 100 3 3 1 0 ECE 402 Digital System Design 50 50 100 3 3 1 0 ECE 403 Wireless Communications 50 50 100 3 3 1 0 ECE 404 Control Engineering 50 50 100 3 3 1 0 ECE 451 Microwave Engineering (Practical) 30 20 50 2 0 0 2 ECE 452 Digital System Design (Practical) 30 20 50 2 0 0 2 ECE 453 Wireless Communications (Practical) 30 20 50 2 0 0 2 CPE Elective-III 50 50 100 3 3 1 0 ECE Elective-IV 50 50 100 3 3 1 0 Total 390 360 750 1 8 6 6 ECE 451,, ECE 452, ECE 453 are practical papers only. There will not be any theory examination for these papers. Elective-III 1. CPE 302 Computer Networking 2. CPE 304 Database Systems 3. CPE 402 Computer Graphics 4. CPE 403 Internet and Web Technologies 5. CPE Advanced Computer Architecture Elective IV 1. ECE 405 Neural Networks and Fuzzy Logic 2. ECE 406 Radar and TV Engineering 3. ECE 407 Satillite Communications 4. ECE 408 Nano Technology 5. ECE 409 Biomedical Instrumentation 6. ECE 410 Optical Networks 7. ECE 411 Digital Image Processing
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ECE 401 MICROWAVE ENGINEERING L T P 3 1 0 Maximum Marks: 50 Maximum Time: 3hrs Maximum Pass Marks: As Per Ordinance. Section-A Microwave tubes and circuits: High frequency limitations of conventional tubes, klystrons – two cavity klystron, multicavity klystron, Reflex klystron, Travelling wave magnetron - operation and characteristics, Helix TWT construction, operation and applications. Section-B Microwave solid state devices & their applications: Classification of Microwave Devices, Diodes-PIN diode, Tunnel Diode, varactor and step recovery diodes, Transferred Electron Devices- GUNN Diode, Avalanche transit time effect- IMPATT, Microwave Transistors and high electron mobility transistor-characteristics and performance. Section-C Microwave components: Waveguide Microwave Junctions, Scattering matrix and their properties, Microwave T junctions – H Plane Tee, E Plane Tee, Magic Tee, Rat Race Junction, Directional coupler –scattering matrix of a directional coupler, Waveguide joints, bends, corners, re-entrant cavities, Ferrite devices – faraday rotation in devices, Section-D Microwave measurements: General measurement setup, Microwave bench, power measurement – low, medium & high, Attenuation measurement, Measurement of VSWR, Smith Charts, Measurement of Impedance, Impedance matching-single and double stub tuners. RECOMMECONDED BOOKS:
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This note was uploaded on 06/26/2011 for the course ECON 103 taught by Professor Professorgill during the Spring '11 term at Cedar Crest.

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btechece4 - B.TECH. (Electronics and Communication...

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