# hw1 - such that its side and back surfaces are well...

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ME 322 HW #1 07.02.2008 1. A square silicon chip ( k = 150 W/m K) is of width w = 5 mm on a side and of thickness t = 1 mm. The chip is mounted in a substrate such that its side and back surfaces are insulated, while the front surface is exposed to a coolant. If 4 W are being dissipated in circuits mounted to the back surface of the chip, what is the steady-state temperature difference between back and front surfaces? chip w = 5 mm t = 1 mm 4 W 2. A square isothermal chip is of width w = 5 mm on a side and is mounted in a substrate
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Unformatted text preview: such that its side and back surfaces are well insulated, while the front surface is exposed to the flow of a coolant at ∞ T = 15 ºC. From the reliability consideration, the chip temperature must not exceed T = 85ºC. (1) If the coolant is air and the corresponding convection coefficient is h = 200 W/m 2 K, what is the maximum allowable chip power? (2) If the coolant is a dielectric liquid for which h = 3000 W/m 2 K, what is the maximum allowable power? w = 5 mm Coolant chip...
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## This note was uploaded on 07/30/2011 for the course ME 324 taught by Professor Nezihtopaloglu during the Spring '11 term at Yeditepe Üniversitesi.

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