hw1 - such that its side and back surfaces are well...

Info iconThis preview shows page 1. Sign up to view the full content.

View Full Document Right Arrow Icon
ME 322 HW #1 07.02.2008 1. A square silicon chip ( k = 150 W/m K) is of width w = 5 mm on a side and of thickness t = 1 mm. The chip is mounted in a substrate such that its side and back surfaces are insulated, while the front surface is exposed to a coolant. If 4 W are being dissipated in circuits mounted to the back surface of the chip, what is the steady-state temperature difference between back and front surfaces? chip w = 5 mm t = 1 mm 4 W 2. A square isothermal chip is of width w = 5 mm on a side and is mounted in a substrate
Background image of page 1
This is the end of the preview. Sign up to access the rest of the document.

Unformatted text preview: such that its side and back surfaces are well insulated, while the front surface is exposed to the flow of a coolant at ∞ T = 15 ºC. From the reliability consideration, the chip temperature must not exceed T = 85ºC. (1) If the coolant is air and the corresponding convection coefficient is h = 200 W/m 2 K, what is the maximum allowable chip power? (2) If the coolant is a dielectric liquid for which h = 3000 W/m 2 K, what is the maximum allowable power? w = 5 mm Coolant chip...
View Full Document

This note was uploaded on 07/30/2011 for the course ME 324 taught by Professor Nezihtopaloglu during the Spring '11 term at Yeditepe Üniversitesi.

Ask a homework question - tutors are online