Lecture_Materials_CES Winter2011 web

Lecture_Materials_CES Winter2011 web - MAPPING THE WORLD OF...

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M APPING APPING THE THE W ORLD ORLD OF OF M ATERIALS Prof. Robert S. Shaefer A: Tamer Crosby TA: Mech. & Aerospace Engr. Dept. UCLA Winter 2011
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OUTLINE Engineering Materials Property Charts py Matching materials to design Resources: “Materials Selection in Mechanical Design”, (“The Text”) by M.F. Ashby, Butterworth Heinemann, Oxford, 1999, Chapters 1 - 4. • The Cambridge Material Selector (CES 4) software -- Granta Design, Cambridge (www.grantadesign.com)
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Evolution of Materials Middle of Your Career Today M. Ashby, 2002
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How many commercially available materials can an engineer choose from? (mentioned the answer during last lecture)
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Need to Chose Materials Based on … Metals, ceramics, glasses MATERIALS polymers py composites. .. Casting , moulding PROCESSES powder methods, machining. .. Flat and dished sheet SHAPES rismatic, prismatic, 3-D
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Families of Materials Steels Cast irons Al-alloys etals PE, PP, PC A (Nylon) lumina Metals Cu-alloys Ni-alloys Ti-alloys PA (Nylon) Polymers, elastomers Butyl rubber GFRP CFRP Alumina Si-Carbide Ceramics, glasses Neoprene Composites KFRP Plywood Soda-glass Pyrex Polymer foams Metal foams Foams Woods Natural aterials Ceramic foams Glass foams materials Natural fibres: Hemp, Flax, Cotton
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SiC-Foam Micrographs Cross-sectional photograph of 2 dense CVD iC am ith pg p 12% dense CVD SiC foam with 1.8 mm thick CVD SiC facesheets; 22% dense CVD SiC foam with 1.8 mm thick CVD SiC facesheets. (both 5X) Ultramet Inc. (www.ultramet.com)
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SiC-Foam Micrographs Ultramet Inc. (www.ultramet.com)
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SiC Foam Micrograph (SEM) A B C Robust thermal behavior of SiC foam/SiC facesheet structure confirmed through oxyacetylene torch testing to 1200ºC Ability of the composite to withstand the estimated mechanical loads established through flexure testing
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SiC Foam Micro-Tomography (X-rays)
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Polymers & Polymers & Elastomers Elastomers Polymer : (greek) polu , “many” meros , "part" Elastomer : (A) unstressed (B) stressed When stress is removed, (B) returns to the (A) configuration.
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Basic material properties General Thermal expansion Mechanical properties Thermal Properties INSTRON Weight: Density , Mg/m 3 Expense: Cost/kg C m , $/kg o ain Mechanical Stiffness: Young’s modulus E, GPa trength: lastic limit MPa Elastic limit, y Ductile materials Expansion coefficient, Thermal str a Strength: Elastic limit y , MPa Fracture strength: Tensile strength ts , MPa Brittleness: Fracture toughness K ic , MPa.m 1/2 Young’s modulus, E , Stress Temperature, T x Thermal conduction Thermal Expansion: Expansion coeff. , 1/K Strain Brittle materials T 1 T o Q joules/sec Area A /A Conduction: Thermal conductivity , W/m.K Electrical Tensile (fracture) strength, ts Thermal conductivity, Heat flux, Q / Conductor? Insulator? Young’s modulus, E Strain (T 1 - T 0 )/x
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INSTRON Designed to evaluate mechanical properties of materials and components Material Sample Load
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Mechanical properties illustrated Stiff Strong Tough All OK !
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This note was uploaded on 08/09/2011 for the course MAE 162D taught by Professor Shaefer during the Winter '11 term at UCLA.

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Lecture_Materials_CES Winter2011 web - MAPPING THE WORLD OF...

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