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Unformatted text preview: system can handle? B.) Repeat the problem for the pump connected directly to the chamber. 3.) A wet chemical etch is desired that will etch a via hole through a silicon wafer for integration into a low inductance, high frequency circuit. If a 482 um/min etch rate is desired, what is the volume ratios of hydrofluoric, nitric and acetic acids required?...
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This note was uploaded on 08/23/2011 for the course ECE 6450 taught by Professor Doolittle during the Fall '10 term at University of Florida.
- Fall '10