Unformatted text preview: system can handle? B.) Repeat the problem for the pump connected directly to the chamber. 3.) A wet chemical etch is desired that will etch a via hole through a silicon wafer for integration into a low inductance, high frequency circuit. If a 482 um/min etch rate is desired, what is the volume ratios of hydrofluoric, nitric and acetic acids required?...
View Full Document
- Fall '10
- Wet chemical etch, liter/sec turbo pump, um/min etch rate