Components bars Norm

Components bars Norm - Components Active Components diodes,...

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Components Active Components diodes, transistors, integrated circuits optoelectronics analog, digital, power based on semiconductor materials Passive Components Resistors Capacitors Inductors
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Active Components Increase in active device performance will place heavy demands throughout all aspects of packaging to meet the performance projections Semiconductor Industry Assoc. (SIA) roadmap projects eeds at 1 GHz and power at 200 W within 8 years, speeds at 1 GHz and power at 200 W within 8 years, although performance has already outstripped the roadmap) New devices (SiC,GaAs, etc) and optoelectronic devices and integration will continue to challenge packaging designers
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Active Part Classification By semiconductor material- Si, GaAs, SiC, other III-V and II-VI compounds By construction technology- CMOS, bipolar, BiMOS, FET By device integration- transistor, integrated circuit, level of integration (LSI, VLSI, ULSI), and type( memory, microprocessor) By application- digital, analogue, mixed signal, power, high speed, microwave
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Critical Performance Attributes Speed Level of integration ( number of gates) Power ( from 1.2 to hundreds of volts) Device feature size ( 1.5 to submicron) Number of interconnects Number of I/Os
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Representation of a MOSFET
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CMOS Gate Construction VDD VDD
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Processes in IC Fabrication E-beam deposition Sputtering Chemical Vapor Deposition MOCVD ( metallorganic CVD) Molecular Beam Epitaxy Ion Implantation Lithography ( optical, UV, X-ray, E-beam)
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CMOS Construction
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Self Alignment by Ion Implantation
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Metallization IC metallization provides the ohmic contact with the semiconductor Multilayer constructions are often required due to adhesion requirement. Adhesion layers include Ti,Ti/W, Cr, Co Multi-level interconnects required for on- chip interconnection. 2-5 layers currently Metallizations must be capable of fine line fabrication ( currently .25 microns) and must be resistant to hillock formation, electromigration, etc) Size reduction increases need for high conductivity
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Multilayer IC Metallization
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SIA Roadmap for Chip Interconnections
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SEM View of Multilayer IC Metallization
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Passive Components Capacitors Ceramic Tantalum solid electrolytic aluminum electrolytic Resistors thick film chip power Magnetic devices inductors transformers
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Recent changes Affecting Passive Components DOD Acquisition reform; abandonment of military specifications and associated audit and quality control functions World wide ISO9000 quality standards, increasing offshore competition Drive towards miniaturization, low power, high frequency applications Increases in automotive, communication and computer applications
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Parallel-plate Capacitor
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Capacitor Properties Capacitance and tolerance Voltage rating Equivalent series resistance(ESR) and power loss Insulating resistance (leakage current) AC rating Capacitance stability with temperature and frequency
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This note was uploaded on 09/15/2011 for the course EML 5562 taught by Professor Staff during the Summer '11 term at FIU.

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Components bars Norm - Components Active Components diodes,...

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