EML 5562 Design Process

EML 5562 Design Process - Design Process Start with...

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Design Process Start with electrical schematic Develop Pin- equivalent schematic Electrical schematics do not show all connections tied together. This schematic goes pin to pin for all components, I/O positions and all power and grounds Select interconnect technology , electrical performance type, component types and configuration Develop net (wire) list List each connect between components for the schematic Determine talkers and listeners so separation can be done Determine thermal loadings and thermal management
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Component Placement Consider a simple design with 6 8-pin ICs and a 14 pin edge connector. Establish an X-Y ordinate system with coordinate system with 00, at the pin 1 position of the connector . A grid system is placed so the wire length between points, can be determined
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Wire length between Pins The wire length is determined using the Manhattan distance, s, where s= x + y This is a valid representation since conductors on a board tend to be routed in the x and y directions. The object of component selection is to minimize wire lengths and cross-overs. Notice that routing, if he design ground rules are no violated, can run between pad locations and under components
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Wire or Net list of connections between components
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Connectivity analysis Because the edge connector is fixed, it is considered as the first seeded device. The chart above represents the number of connections to the edge card connector from each of the packages. Since 5 and 2 have the greatest connectivity to the edge card, they should be located next to the edge card connector, in position A,B or C The connectivity of the wire list shows device 2 has an average length of pad to connector of 5.2 units, a position between A and where for device 5, it is 8.6, a position near B Device 2 should be seeded at A and device 5 seeded at position B.
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EML 5562 Design Process - Design Process Start with...

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