EML 5562-PackagingOverview-Electrical

EML 5562-PackagingOverview-Electrical - EML 5562 Advanced...

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Unformatted text preview: EML 5562 Advanced Electronic Packaging W. Kinzy Jones, Professor MME MWF 11:00-11:50 Jones@fiu.edu 305-393-0506(mobile) 305-348-4663 (office ) Notes on the field I am Past President and Fellow, IMAPS, The Microelectronics and Packaging Society Research in advanced packaging, 1 st Level Assembly, Thermal Management, Components d Electronic Materials unded over $7MM in and Electronic Materials- Funded over $7MM in past 15 years Electronic packaging is a application field that crosses over many disciplines. There are 80,000 ME working in the field. Conferences/journals by ASME, IEEE, ASM, IMAPS, etc. All former graduate student hired prior to graduation! Outline Technological Drivers Design Process Electrical Consideration Mechanical Constraints hermal Management Thermal Management Material Science Fundamentals Interconnect Technology Laminate technology Ceramic Processes ( thick film, cofire ceramic) Thin Film Deposited Outline (Cont.) Components Active components technologies Passive Components technologies IC Packaging ( from DIP to System-on-package (SOP)) Assembly First Level Assembly ( wire bonding, flip chip) Soldering Manufacturing Processes Reliability MIL Standards Reliability Projections Introduction to Microsystems Packaging Definition of Packaging IC Packaging is a Bridge from IC to System Board It Controls: >90% size Performance Cost Reliability Packaging Hierarchy Microsystems Technologies System Packaging Involves Electrical, Mechanical and Materials Technologies Analogy Between Human and Electronics Trend to Convergent Microsystems Discrete Systems Packaging EMS Microelectronics Photonics F Convergent Microsystems Past Future MEMS RF Bioelectronics Building Block of Microsystems Packaging 1000 10000 WW S/C Revenue ($B) Trend to Convergent Systems Transistors / chip 1B 100M 10B 100B PCs / Servers PCs / Servers r All businesses, people, objects All businesses, people, objects r Network computing Network computing r Wide area / bandwidth Wide area / bandwidth r Graphical, voice, multimedia, etc. Graphical, voice, multimedia, etc. r Many vendors / platforms Many vendors / platforms Internet Internet Wireless Wireless Wired Wired Convergent Systems 1975 1995 2015 Year 1 10 100 r Businesses Businesses r Host Host-based computing based computing r Mainframe Mainframe r Dumb terminal Dumb terminal r Few vendors / architecture Few vendors / architecture Mainframes Mainframes 1M 10M 100K 10K 1K PCs PCs r Businesses & some people Businesses & some people r Client Client-server computing server computing r Local area connection Local area connection r Text/graphical interface Text/graphical interface r Many vendors / few architectures Many vendors / few architectures Today Today Source: Russ Lange, IBM Microelectronics What are Convergent Microminiaturized Microsystems (CMM)?...
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EML 5562-PackagingOverview-Electrical - EML 5562 Advanced...

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