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EML 5562-PackagingOverview-Electrical

EML 5562-PackagingOverview-Electrical - EML 5562 Advanced...

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EML 5562 Advanced Electronic Packaging W. Kinzy Jones, Professor MME MWF 11:00-11:50 [email protected] 305-393-0506(mobile) 305-348-4663 (office )
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Notes on the field I am Past President and Fellow, IMAPS, The Microelectronics and Packaging Society Research in advanced packaging, 1 st Level Assembly, Thermal Management, Components and Electronic Materials- Funded over $7MM in past 15 years Electronic packaging is a application field that crosses over many disciplines. There are 80,000 ME working in the field. Conferences/journals by ASME, IEEE, ASM, IMAPS, etc. All former graduate student hired prior to graduation!
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Outline Technological Drivers Design Process Electrical Consideration Mechanical Constraints Thermal Management Material Science Fundamentals Interconnect Technology Laminate technology Ceramic Processes ( thick film, cofire ceramic) Thin Film Deposited
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Outline (Cont.) Components Active components technologies Passive Components technologies IC Packaging ( from DIP to System-on-package (SOP)) Assembly First Level Assembly ( wire bonding, flip chip) – Soldering Manufacturing Processes Reliability MIL Standards Reliability Projections
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Introduction to Microsystems Packaging
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Definition of Packaging IC Packaging is a Bridge from IC to System Board It Controls: >90% size • Performance • Cost • Reliability
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Packaging Hierarchy
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Microsystems Technologies
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System Packaging Involves Electrical, Mechanical and Materials Technologies
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Analogy Between Human and Electronics
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Trend to Convergent Microsystems Discrete Systems Packaging MEMS Microelectronics Photonics RF Convergent Microsystems Past Future Bioelectronics
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Building Block of Microsystems Packaging
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1000 10000 WW S/C Revenue ($B) Trend to Convergent Systems Transistors / chip 1B 100M 10B 100B PCs / Servers rhombus4 All businesses, people, objects rhombus4 Network computing rhombus4 Wide area / bandwidth rhombus4 Graphical, voice, multimedia, etc. rhombus4 Many vendors / platforms Internet •Wireless Wireless •Wired Wired Convergent Systems 1975 1995 2015 Year 1 10 100 rhombus4 Businesses rhombus4 Host -based computing based computing rhombus4 Mainframe rhombus4 Dumb terminal rhombus4 Few vendors / architecture Mainframes 1M 10M 100K 10K 1K PCs rhombus4 Businesses & some people rhombus4 Client -server computing server computing rhombus4 Local area connection rhombus4 Text/graphical interface rhombus4 Many vendors / few architectures Today Source: Russ Lange, IBM Microelectronics
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What are Convergent Microminiaturized Microsystems (CMM)? Convergent: Two or more functions Microminiaturized: >1000x volume reductions Microsystems: systems with micro-scale technologies
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Trend to Convergent Microminiaturized Systems (CMM) Functional Data and Voice CONSUMER ELECTRONICS MEDICAL Technology Digital, RF, Analog and Optical Product – Computer, consumer and telecom Video Cell Phone Medical Implant/ Diagnostic Monitor/ Communicator
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The Invention of the First IC
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Moore ’s Law: Doubles Every 18 Months
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SOC Advances Cu - low K Moore’s Law SOI SiGe
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