single package multi chip overview

single package multi chip overview - Evolution of IC...

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Unformatted text preview: Evolution of IC Packages Family . QFP BGA FC—BGA ‘ DCA SOP EC Wire bond Wire bond Soiderbail -- Flip chip Package Leadftame Substrate Substrate Thin—film Substrate Substrate Substrate 51 efficiency 30 50 75 100 >100 >100 >100 41h die 3rd die 2nd die Si—spacer 15tdie Die attach Dies Solder balls fiim/paste Dielectric Organic or inorganic spacer materials MgmpijeviquA/ " / fl, ‘ __ : E .___... , H], 1' . I ’Kféemos'rgf deV'CG-S .- ,M’e’mo'ry devlpeifl, w, _ - - Memory deviceaa, ', w . , r , 4 ' ' ' I I , p7— ' ’ sfMe’mow-dev‘lbe-f " L . _ .. . , l - Méfnory dgyigefi ' Flexible substrate Adhesive Overmold Adhesive Flex substrate ...
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This note was uploaded on 09/15/2011 for the course EML 5562 taught by Professor Staff during the Summer '11 term at FIU.

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single package multi chip overview - Evolution of IC...

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