Thermal Analysis

Thermal Analysis - Importance of Thermal Analysis s...

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Unformatted text preview: Importance of Thermal Analysis s Approximately 70% of failures are due to thermal loads on components. s The failure rates of most components can double with a 20C increase in the junction temperature operating at about 50% of their rated power. s Electrical performance of many components is temperature dependent. Thermal Acceleration Factor for Typical IC Devices Hotter, Smaller Packaging s Power densities continue to increase due to : Larger chip sizes Increased dissipated power Smaller packaging technology s First SIA Roadmap predicts : 40 W/die by 2001- already there 200 W/die by 2007 s Temperature limits have remained the same: Maximum junction temperatures of 150- 175C. Reliability requires lower junction temperatures. Integrated Thermal Design s Successful design requires adequate thermal management from: Junction to Case or case to substrate Substrate (or heat sink) to External ooling Source Cooling Source s Any one weak link in the thermal path can ruin the design. s Many times thermal management is an integral part of the structural design of the package. s Late changes to correct thermal problems can require costly redesign. Methods of Heat Transfer s Conduction Thermally conductive materials are used to transport heat from source to sink. Heat is transferred atom to atom through a material. s Convection Working fluid transports heat from source to sink. Heat is transferred by both diffusion and advection. s Radiation Heat is transferred by electromagnetic waves through liquids, gases, and vacuums. Conduction Heat Transfer Heat Input Heat Input Electrical/Thermal Conductivity Area A Area A Area A Area A A) Thermal Flow A) Thermal Flow B) Electrical Flow B) Electrical Flow Heat Heat Source Source T 1 Thermal Conductivity of Various Materials...
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This note was uploaded on 09/15/2011 for the course EML 5562 taught by Professor Staff during the Summer '11 term at FIU.

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Thermal Analysis - Importance of Thermal Analysis s...

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