This preview shows pages 1–3. Sign up to view the full content.
This preview has intentionally blurred sections. Sign up to view the full version.View Full Document
Unformatted text preview: Dr. Byoung Hee You 5. List three traditional planarization methods Ans) 1) Etchback Planarization 2) Glass Reflow 3) Spin-on-films 6. List nine parameters for chemical mechanical planarization (CMP). Ans) 1) Polish time 2) Pressure on wafer carrier (downforce) 3) Platen speed 4) Carrier speed 5) Slurry chemistry 6) Slurry flow rate 7) Pad conditioning 8) Wafer/slurry temperature 9) Wafer back pressure 7. Four important functions of Packaging Ans) 1) Protection from the environment and handling damage 2) Interconnections for signals into and out of the chip 3) Physical support of the chip 4) Heat dissipation Dr. Byoung Hee You 8. List design constraints for IC packaging Ans) 1) Peformance 2) Size/weight/form 3) Materials 4) Cost 5) Assembly...
View Full Document
This note was uploaded on 09/21/2011 for the course MFGE 4392 taught by Professor You during the Spring '11 term at Texas State.
- Spring '11