This preview has intentionally blurred sections. Sign up to view the full version.View Full Document
Unformatted text preview: 3) Gross defects 5. List and describe three types of point defects. Ans) 6. List basic process steps for wafer preparation. Ans) Dr. Byoung Hee You 7. What is the purpose of wafer lapping and edge contour? Ans) - two-sided lapping → removing damage left by slicing → achieving high parallelism and flatness - edge contour → contouring a smooth radius → preventing cracks and crevices 8. List seven wafer quality requirements for a silicon wafer. Ans) 1) Physical dimensions: diameter, thickness, flat, and wafer deformation 2) Flatness 3) Microroughness: maximum and minimum height deviation, RMS 4) Oxygen content: by using cross-section, composition analysis of silicon crystal structure 5) Crystal defects: per cm 2 (less than 1,000) 6) Particles: per m 2 (less than 1,300), particle size (greater than 0.08 μm) 7) Bulk resistivity: uniform resistivity through the bulk...
View Full Document
This note was uploaded on 09/21/2011 for the course MFGE 4392 taught by Professor You during the Spring '11 term at Texas State.
- Spring '11