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Homework_5_Solution - 5 Why are native oxides a problem for...

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Dr. Byoung Hee You TECH 4392, MFGE 4392, and TECH 5392 Solutions: Homework#5 1. List five Types of Contamination in wafer fabrication. Ans) Particles, Metallic Impurities, Organic Contamination, Native Oxides, and Electrostatic Discharge 2. What is a particle? Why are particles a problem for semiconductor manufacturing? Ans) Particles are small objects that can be adhered to the surface of a wafer. They cause leading to open or bridged circuitry creating an electrical short. 3. Why are metallic impurities a problem for semiconductor manufacturing? Ans) Mobile ionic contaminant alters threshold voltage of a transistor. 4. List five sources for organic contamination. Ans) Bacterial, lubricants, vapors detergents, solvents, and moisture.
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Unformatted text preview: 5. Why are native oxides a problem for semiconductor manufacturing? Ans) Native oxide interferes with the growth of single-crystal film and ultra thin gate oxide → electrical contact problem 6. List seven sources of contamination in a wafer Fabrication. Ans) Air, Humans, Facility, Water, Process chemicals, Process gases, and Production equipment Dr. Byoung Hee You 7. State Megasonic Cleaning. Ans) Megasonic cleaning is the most common way to clean a wafer using ultrasonic energy with frequencies near 1MHz. The vibration of a megasonic transducer creates pressure wave in the tank, so particles on the wafer can be removed using cavitation (formation of bubles) and acoustic streaming (flowing liquid)...
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Homework_5_Solution - 5 Why are native oxides a problem for...

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