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Unformatted text preview: 5. Why are native oxides a problem for semiconductor manufacturing? Ans) Native oxide interferes with the growth of single-crystal film and ultra thin gate oxide → electrical contact problem 6. List seven sources of contamination in a wafer Fabrication. Ans) Air, Humans, Facility, Water, Process chemicals, Process gases, and Production equipment Dr. Byoung Hee You 7. State Megasonic Cleaning. Ans) Megasonic cleaning is the most common way to clean a wafer using ultrasonic energy with frequencies near 1MHz. The vibration of a megasonic transducer creates pressure wave in the tank, so particles on the wafer can be removed using cavitation (formation of bubles) and acoustic streaming (flowing liquid)...
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- Spring '11
- Particle Physics, Semiconductor device fabrication, Dr. Byoung Hee