Homework_8_Solution

Homework_8_Solution - 9) Contaminants and particles 10)...

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Dr. Byoung Hee You TECH 4392, MFGE 4392, and TECH 5392 Solutions: Homework#8 1. List characteristics of negative and positive resist. Ans) Negative Resist 1) Wafer image is opposite of mask image 2) Exposed resist hardens and is insoluble 3) Developer removes unexposed resist Positive Resist 1) Mask image is same as wafer image 2) Exposed resist softens and is soluble 3) Developer removes exposed resist 2. List physical characteristics of photoresist. Ans) 1) Resolution 2) Contrast 3) Sensitivity 4) Viscosity 5) Adhesion 6) Etch resistance 7) Surface tension 8) Storage and handling
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Unformatted text preview: 9) Contaminants and particles 10) State three stages in film growth. Dr. Byoung Hee You 3. List eight steps of photolithography. Ans) 1) Vapor prime 2) Spin coat 3) Soft bake 4) Alignment and Exposure 5) Post-exposure bake 6) Develop 7) Hard bake 8) Develop inspect 4. What is the role of soft baking Ans) 1) Improves photoresist-to-wafer adhesion 2) Promotes resist uniformity on wafer 3) Improves line width control during etch 4) Drives off most of solvent in photoresist 5. What is the role of hard baking Ans) 1) Evaporate remaining solvent 2) Improve resist-to-wafer adhesion...
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Homework_8_Solution - 9) Contaminants and particles 10)...

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