{[ promptMessage ]}

Bookmark it

{[ promptMessage ]}

VLSI_Class_Notes_10_2010

# VLSI_Class_Notes_10_2010 - EEL 5322 W.R.Eisenstadt-1 VLSI...

This preview shows pages 1–2. Sign up to view the full content.

EEL 5322 W.R.Eisenstadt - 1 - VLSI Class Notes 10, Fall 2010 , Homework Problem # 9, Due Wednesday, Sept 22, 2010. 1) Re-do the problem in class under the conditions of SML = 0.05 um << feature size and MFP = 200 um >> feature size. In this problem there is a set of 0.80 um thick metal lines on oxide separated by 2.0 um spaces. i) Determine the thickness of the LTO layer to be deposited so that there will be at least 1.0 um of Oxide in all places after the CMP step. ii) Draw the cross section in scale after the LTO is deposited. Reading Today: Jaeger Section 3.8.2, 7.7 and 7.8 Lecture discussion : Chemical Mechanical Polish (CMP) A processed surface of the silicon wafer after transistor formation and depositing an inter-level dielectric has a lot of surface topography. If you look at the cross-section before metallization, the surface is flat. How to get a flat surface? Chemical Mechanical Polish (CMP). The basic process sands in the uneven topography away to achieve a planar surface over the entire chip and wafer. A CMP system consists of a rotating table which holds a polishing cloth pad that is also rotating. In addition, there is wafer holder which is rotating. The polishing process adds a wet slurry which consists of an abrasive compound and a component that chemically interacts with the wafer surface being polished. The abrasive compound has similar hardness as the material being polished to prevent gross mechanical damage to the wafer surface. Polishing results from a combination of

This preview has intentionally blurred sections. Sign up to view the full version.

View Full Document
This is the end of the preview. Sign up to access the rest of the document.

{[ snackBarMessage ]}

### What students are saying

• As a current student on this bumpy collegiate pathway, I stumbled upon Course Hero, where I can find study resources for nearly all my courses, get online help from tutors 24/7, and even share my old projects, papers, and lecture notes with other students.

Kiran Temple University Fox School of Business ‘17, Course Hero Intern

• I cannot even describe how much Course Hero helped me this summer. It’s truly become something I can always rely on and help me. In the end, I was not only able to survive summer classes, but I was able to thrive thanks to Course Hero.

Dana University of Pennsylvania ‘17, Course Hero Intern

• The ability to access any university’s resources through Course Hero proved invaluable in my case. I was behind on Tulane coursework and actually used UCLA’s materials to help me move forward and get everything together on time.

Jill Tulane University ‘16, Course Hero Intern