VLSI_Class_Notes_12_2010 - EEE 5322 W.R Eisenstadt-1 VLSI...

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EEE 5322 W.R. Eisenstadt - 1 - VLSI Class Notes Fall 2010 four, Class 12 Reading Today: Jaeger Chapter 2.1, 2.3, 2.4 and 2.5, Homework Due: Wednesday, Sept. 29, 2010, p. 41-42, Jaeger 2.2 and 2.3 Read IEEE Spectrum magazine article, Sept 2003, F. Schellenberg, pp. 34 - 40. A little Light Magic , accessable from a UF computer using UF libraries e-journal. See Wikipedia http://en.wikipedia.org/wiki/Immersion_lithography Lecture discussion : Photolithography Photolithography is a method of printing images on wafers. Optical Photolithography: 130 nm going to 90nm. Short wavelength ultraviolet will be used for 100nm and below. High throughput is a critical requirement. Immersion Lithography: Used in 45nm and below technology nodes. Absolutely necessary for feature sizes below 37nm, such as the latest 32nm state-of-the art CMOS. Air gap in lithography between the replaced by a liquid. Light goes from the end of a lens system through liquid to the wafer surface. Alternative lithography systems : currently not in common use. E-Beam: 0.1 nm and below, traditionally throughput has been a problem (high-cost). Research continues all in improving e-beam throughput. SCALPEL (Scattering with Angular limitation Projection Electron-beam Lithography) is a promising high throughput technique.
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This note was uploaded on 10/02/2011 for the course ECE 5322 taught by Professor Ei during the Spring '10 term at University of Florida.

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VLSI_Class_Notes_12_2010 - EEE 5322 W.R Eisenstadt-1 VLSI...

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