lecture_24_-_si_manufacturing

lecture_24_-_si_manufacturing - ME 350 Lecture 24 Si...

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Unformatted text preview: ME 350 Lecture 24 Si Manufacturing silicon microphone Digital display From Si crystal to Wafers Upper polishing pad Lower polishing pad Wafer Slurry Single crystal growth Slicing Polishing From Wafers to Chips 200mm 0.5mm Example: Process flow of DMD Processing Steps in Final Packaging • Wafer testing • Chip separation • Die bonding • Wire bonding • Package sealing • Final testing Process flow Additive Lithography subtractive Wafers Chips Photoresist coating Pattern transfer Photoresist removal Oxidation Sputtering Evaporation CVD Wet isotropic Wet anisotropic Plasma RIE DRIE Learning Objectives • Understanding basic principles of – photolithography, – oxidation, diffusion and vapor deposition, – dry and wet etching In depth study in ME498 Process flow Additive Lithography subtractive Wafers Chips Photoresist coating Pattern transfer Photoresist removal Optical Lithography (Shadow) Photomask Photo resist Substrate UV light 1) Fabricating Mask and Coat resist 2) Expose 3) Develop (positive) 4) Develop (Negative) Optical Lithography (Projection) Advantage: Low defect Reduction ratio Disadvantages: Expensive system Lower resolution Photolithography in action! Process flow Additive Lithography subtractive Wafers Chips Oxidation Sputtering Evaporation CVD Additive Processes • Thermal oxidation – adds SiO 2 layer on Si substrate • Diffusion and ion implantation- alters chemistry of an existing layer or substrate...
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This note was uploaded on 10/03/2011 for the course ME 350 taught by Professor Staff during the Spring '08 term at University of Illinois, Urbana Champaign.

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lecture_24_-_si_manufacturing - ME 350 Lecture 24 Si...

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