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ELEC3300_11_stu - ELEC 3300 Microprocessor Applications...

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ELEC 3300 : Fall 11/12 Tim Woo 1 ELEC 3300 Microprocessor Applications Topic 11 Memory, Interfacing to Memory, Memory Timing, Memory, Interfacing to Memory, Memory Timing, and Applications and Applications Prof. Tim Woo Prof. Tim Woo
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ELEC 3300 : Fall 11/12 Tim Woo 2 Where we are Timer and Counter Basic Computer Structure Introduction to Microprocessor-based Systems Digital and Analog Interfacing Interrupt Organization Memory, Interfacing to Memory, Memory Timing and applications Motor Interfacing Buffering and Direct Memory Access (DMA) Interfacing LCD Other Serial Bus Interface: IEEE1394, USB, I2C and SPI Serial Communication and RS-232 Standard To be covered In progress Done Microcontroller Structure A/D Port Assembler Instruction Set Architecture Memory I/O System Datapath & Control CPU Serial Port External Memory Port Interrupt Port Simple Port In this course, 8051 is used as a driving vehicle for delivering the concepts.
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ELEC 3300 : Fall 11/12 Tim Woo 3 On successful completion of this topic, you will be able to Summarize the types of memory technologies Interpret both hardware and software interfacing including CPU memory interface Timing diagrams of memory accesses ( Read / Write / Refresh Operations) Explain key considerations of memory architectures including Memory Expansion Paging Analyze memory architecture for mobile embedded systems Introduce some upcoming memory architecture Expected Outcomes Expected Outcomes
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ELEC 3300 : Fall 11/12 Tim Woo 4 Memory Technologies Memory Technologies FLASH High Density Non-volatile Updateable UVEPROM E 2 PROM / EEPROM PROM (OTP) DRAM SRAM •Non-volatile •High density •Erasable by UV light (takes an hour) •programmed many times (~100) UVEPROM (UV Erasable Programmable ROM) •Non-volatile •Lower density •Lower reliability •Higher cost •Erasable by electrical (takes few ms) •programmed many times (~1000) EEPROM (Electrically Erasable Programmable ROM) •Non-volatile •High density •Reliable •Low cost •One-time programmable (OTP) (suitable for mass production with stable code) PROM (Programmable ROM) •High density •Low cost •High speed •Lower power •High reliability FLASH •High density •Low cost •High speed •Lower power •Refreshing is required DRAM (Dynamic RAM) SDRAM (Synchronous DRAM) DDR SDRAM (Double Data Rate SDRAM) •Low density •Low cost •High speed •Lower power SRAM (Static RAM) SSRAM (Synchronous SRAM)
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ELEC 3300 : Fall 11/12 Tim Woo 5 Memory Technologies Memory Technologies
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ELEC 3300 : Fall 11/12 Tim Woo 6 CPU-Memory interface usually consists of Unidirectional address bus Bidirectional data bus Read/write control lines Ready control lone Size (byte, word) control line Memory access involves memory bus transaction Read : set address, read and size, copy data when ready is set by memory Write : set address, write and size, done when ready is set CPU CPU - - Memory Interface Memory Interface
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ELEC 3300 : Fall 11/12 Tim Woo 7 Example 1: EEPROM Timing for Read Access Example 1: EEPROM Timing for Read Access Chip Enable Output Enable Step 1: send the address to EEPROM
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