Lec-16_Power-Distribution-a

Lec-16_Power-Distribution-a - EE M216A .:. Fall 2010...

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EE M216A .:. Fall 2010 Lecture 16 Power Distribution Prof. Dejan Markovi ć ee216a@gmail.com Power = … ± Routing resources 20 40% of all metal tracks used by Vdd, Gnd Increased power Æ denser power grid ± Pin Pins Vdd or Gnd pin carries 0.5 1W of power Pentium 4 uses 423 pins: 233 Vdd or Gnd More pins Æ higher cost package (+ package development, board design…) ± Battery cost 1kg NiCd can power P4 for <1hr D. Markovic / Slide 2 ± Performance High chip temperature degrades performance Large across chip temp variations induce clk skew High chip power limits use of high perf cicruits Power transients determine min supply Courtesy: A. Kahng Lecture 17: Power Distribution | 2 EEM216A .:. Fall 2010
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Power = Package D. Markovic / Slide 3 Courtesy: A. Kahng Lecture 17: Power Distribution | 3 EEM216A .:. Fall 2010 Packaging ± Package functions Mechanical connection of chip to board Electrical connection of signals and power from chip to board with very little delay or distortion Short wires with low R and L Removes heat produced on chip and thermal expansion and stress Protects chip from mechanical damage Inexpensive to manufacture and test ± Main issues: Cost Thermal impedance D. Markovic / Slide 4 Thermal impedance: how effectively package removes heat from the die Lead inductance Ceramic pin grid array package – lowest Cheap epoxy plastic – highest [Reading: Weste, Harris VLSI book] Lecture 17: Power Distribution | 4 EEM216A .:. Fall 2010
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Package Types ± Through hole vs. surface mount D. Markovic / Slide 5 Lecture 17: Power Distribution | 5 EEM216A .:. Fall 2010 Multi Chip Modules ± Pentium Pro MCM Fast connection of CPU to cache Expensive, requires known good dice D. Markovic / Slide 6 Lecture 17: Power Distribution | 6 EEM216A .:. Fall 2010
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Concept of a Typical Chip Package Chip Bonding Wire Mounting Cavity Lead Frame L L’ D. Markovic / Slide 7 EEM216A .:. Fall 2010 Lecture 17: Power Distribution | 7 Pin ± Traditionally, chip is surrounded by pad frame Metal pads on 100 – 200 µ m pitch Gold bond wires attach pads to package Ld f di t ib t i l i k Chip to Package Connections Lead frame distributes signals in package Metal heat spreader helps with cooling D. Markovic / Slide 8 Lecture 17: Power Distribution | 8 EEM216A .:. Fall 2010
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Chip / Package Alignment ± Alight top left corners and do simple bonding Top Left (index marker) Top Left (L shapes) D. Markovic / Slide 9 die package Lecture 17: Power Distribution | 9 EEM216A .:. Fall 2010 Example Package Data Sheet SSM P/N CPG12028 D. Markovic / Slide 10 www.spectrum semi.com Lecture 17: Power Distribution | 10 EEM216A .:. Fall 2010
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± 120 pins chip: 3.5mm 2 ± 90 87 86 93 92 89 96 95 91 99 97 94 101 100 98 104 103 102 107 105 106 108 109 110 111 112 114 113 115 118 116 119 1 117 2 5 120 3 6 A B C 1 2 3 4 5 6 7 8 9 10 11 12 13 Figure out Pin Locations (PCB Routing) Ceramic PGA SSM P/N CPG12028 (~ $30) ± Test socket YAMAICH 83 81 78 77 74 85 82 79 75 73 88 84 80 76 72 4 8 12 16 20 7 10 13 15 19 9 11 14 17 18 D E F G H D. Markovic / Slide 11 YAMAICHI NP89 19601 KS11730 (~ $70) 71 69 66 63 61 70 67 65 62 57 68 64 60 59 56 58 55 53 54 52 51 50 49 48 46 45 47 42 43
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This note was uploaded on 10/19/2011 for the course ELECTRICLA 216A taught by Professor Marković during the Fall '10 term at UCLA.