Lec-17_Testability-a

Lec-17_Testability-a - EE M216A Fall 2010 Lecture 17...

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EE M216A .:. Fall 2010 Lecture 17 Testability Prof. Dejan Markovi ć [email protected] Semiconductor Memory ± It is an important component 30% of the worldwide semiconductor business DRAMs are a very high volume product Ebd ddl l tl Embedded all non memory parts as well ± Often drives technology development Technologies can be specialized for memory DRAM have special capacitors, SRAMs special loads ± Intense “device level” circuit design proces D. Markovic / Slide 2 Intense device level circuit design process Large benefit to improved circuit performance Digital and analog design issues Lecture 18: Memory, Testability | 2 D. Markovi ć .:. Fall 2010
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Types of Memory ± There are many types of memory Usually distinguished by type of memory and access method ± Access methods Random access memory – RAM You can access any memory location at the same speed Most common type of memory Content address memory – CAM Access memory by a search on its contents E.g. find location where the upper byte is 250 D. Markovic / Slide 3 ± Memory Types Static – SRAM, read/write memory Dynamic – DRAM, read/write/refresh memory Read only – ROM, read mostly (PROM, EEPROM) Programmable ROM, Electrically Erasable PROM Lecture 18: Memory, Testability | 3 D. Markovi ć .:. Fall 2010 Testability: Overview Reading W&H: Chapter 9 Introduction – ± Sili d b i i i bl th t i th Most slides in this lecture are from: Shannon Morton, (SGI), ISSCC 2003 Silicon debugging is a growing problem that accompanies the increasing complexity of current designs. This lecture discusses how chips fail, how chips are tested and debugged. ± Design for Test and Debug” is the art of adding functionality to the chip to enhance its controllability and observability so that it can be effectively debugged and tested for correct operation. C t ll bilit th bilit t th t t f i t l d D. Markovic / Slide 4 Controllability: the ability to set the state of internal nodes from the chip’s input pads. Observability: the ability to propagate the state of internal nodes to the chip’s output pads. Lecture 18: Memory, Testability | 4 D. Markovi ć .:. Fall 2010
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Do You Want Unhappy Customers? Yo Dude ! Where do you want this truck load of returns ?!! Express Returns D. Markovic / Slide 5 ± Pentium FP divider bug in 1994 cost the company $450 million dollars. (People got fired over this!) Lecture 18: Memory, Testability | 5 D. Markovi ć .:. Fall 2010 Technology Scaling ± IC Scaling: 0.7x technology shrink 2x increase in number of internal nodes From 1 µ m technology to 0.1 µ m 100x increase in complexity of internal state Die size also increasing even more states Only a small relative increase in the number of pins available for test.
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This note was uploaded on 10/19/2011 for the course ELECTRICLA 216A taught by Professor Marković during the Fall '10 term at UCLA.

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Lec-17_Testability-a - EE M216A Fall 2010 Lecture 17...

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