HW5_Additivity22

HW5_Additivity22 - 16.881 Robust System Design Homework #5...

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16.881 – Robust System Design Homework #5 Design for Additivity Due Date: Thursday, June 18, 1:05, 4-149 Objectives: Explore the effect of the choice of system response on the accuracy of an additive model of a system Reinforce material from earlier sessions Assignment The figure below depicts a side view of an electronic package. The ribbon leads are formed in a die into a leg shape (the industry uses a set of anthropomorphic terms as defined in Figure 1 ). The problem is that the yield strength of the leads varies by ± 10% about its nominal value of 200MPa. This tends to make the spring-back of the ribbon lead during the forming process inconsistent and hence the air gap is inconsistent. This is a problem as the air gap is filled with thermally conductive material. If the air gap is too small, the fill material will overflow from the bottom of the package and foul the contacts. If the air gap is too great, there will be insufficient area covered by conductive material. You have been given the task of making this process more robust to the
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HW5_Additivity22 - 16.881 Robust System Design Homework #5...

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