SRAM_Datasheet - W24257A 32K × 8 HIGH SPEED CMOS STATIC...

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Unformatted text preview: W24257A 32K × 8 HIGH SPEED CMOS STATIC RAM GENERAL DESCRIPTION The W24257A is a high speed, low power CMOS static RAM organized as 32768 × 8 bits that operates on a single 5-volt power supply. This device is manufactured using Winbond's high performance CMOS technology. FEATURES • High speed access time: 10/12/15/20 nS (max.) • All inputs and outputs directly TTL compatible • • Three-state outputs • • Low power consumption: − Active: 400 mW (typ.) Single +5V power supply • Fully static operation Available packages: 28-pin 300 mil SOJ, 330 mil SOP, skinny DIP and standard type one TSOP (8 mm × 13.4 mm) BLOCK DIAGRAM PIN CONFIGURATIONS VDD VSS A14 1 28 2 27 WE A7 3 26 A13 A6 4 25 A8 A5 5 24 A9 A4 6 23 A11 A3 7 22 A0 . . VDD A12 OE 28-pin DIP DECODER A14 A2 8 21 A10 A1 9 20 CS A0 10 19 I/O8 I/O1 11 18 12 17 13 16 14 15 CONTROL DATA I/O I/O1 . . I/O8 I/O5 V SS OE I/O6 I/O3 CS I/O7 I/O2 CORE ARRAY I/O4 WE PIN DESCRIPTION OE A11 A9 A8 A13 WE V DD A14 A12 A7 A6 A5 A4 A3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28-pin TSOP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 SYMBOL A0−A14 I/O1−I/O8 CS Write Enable Input OE VDD VSS -1- DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Input WE A10 CS I/O8 I/O7 I/O6 I/O5 I/O4 V SS I/O3 I/O2 I/O1 A0 A1 A2 Output Enable Input Power Supply Ground Publication Release Date: May 1997 Revision A14 W24257A DC CHARACTERISTICS Absolute Maximum Ratings PARAMETER RATING UNIT -0.5 to +7.0 V Input/Output to VSS Potential -0.5 to VDD +0.5 V Allowable Power Dissipation 1.0 W -65 to +150 °C 0 to +70 °C Supply Voltage to VSS Potential Storage Temperature Operating Temperature Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device. TRUTH TABLE I/O1−I/O8 CS OE WE MODE VDD CURRENT H X X Not Selected High Z ISB, ISB1 L H H Output Disable High Z IDD L L H Read Data Out IDD L X L Write Data In IDD OPERATING CHARACTERISTICS (VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C) PARAMETER Input Low Voltage Input High Voltage Input Leakage Current SYM. VIL VIH ILI Output Leakage Current ILO Output Low Voltage Output High Voltage VOL VOH IDD Operating Power Supply Current Standby Power Supply Current TEST CONDITIONS VIN = VSS to VDD MIN. -0.5 +2.2 -10 VI/O = VSS to VDD, CS = VIH or OE = VIH or WE = VIL IOL = +8.0 mA IOH = -4.0 mA 10 CS = VIL, I/O = 0 mA Cycle = MIN Duty = 100% 12 15 20 ISB CS = VIH Cycle = MIN, Duty = 100% ISB1 CS ≥ VDD -0.2V Note: Typical characteristics are at VDD = 5V, TA = 25° C. -2- TYP. - MAX. +0.8 VDD +0.5 +10 UNIT V V -10 - +10 µA 2.4 - - 0.4 170 V V mA - - - - 160 150 140 30 mA mA mA mA - - 10 mA µA W24257A CAPACITANCE (VDD = 5V, TA = 25° C, f = 1 MHz) PARAMETER SYM. CONDITIONS MAX. UNIT Input Capacitance CIN VIN = 0V 8 pF Input/Output Capacitance CI/O VOUT = 0V 10 pF Note: These parameters are sampled but not 100% tested. THERMAL RESISTANCE PARAMETER SYM . CONDITIONS MAX. UNIT Junction to Case Thermal Resistance θJC A. F. R. = 1m/sec, TA = 25° C 20 °C/W Junction to Ambient Thermal Resistance θJA A. F. R. = 1m/sec, TA = 25° C 60 °C/W Note: These parameters are only applied to "TSOP" and "SOJ" package types. AC TEST CONDITIONS PARAMETER CONDITIONS Input Pulse Levels 0V to 3V Input Rise and Fall Times 5 nS Input and Output Timing Reference Level 1.5V Output Load CL = 30 pF, IOH/IOL = -4 mA/8 mA -3- Publication Release Date: May 1997 Revision A14 W24257A AC TEST LOADS AND WAVEFORM R1 480 ohm 5V R1 480 ohm 5V OUTPUT OUTPUT 5 pF 30 pF Including Jig and Scope R2 255 ohm Including Jig and Scope R2 255 ohm (For TCLZ , TOLZ , TCHZ, TOHZ , TWHZ , TOW ) 3.0V 90% 10% 0V 90% 10% 5 nS 5 nS -4- W24257A AC CHARACTERISTICS (VDD = 5V ±10%, VSS = 0V, TA = 0 to 70° C) Read Cycle PARAMETER SYM. W24257A-10 W24257A-12 W24257A-15 W24257A-20 MIN. MAX. MIN. MAX. MIN. MAX. MIN. UNIT MAX. Read Cycle Time TRC 10 - 12 - 15 - 20 - nS Address Access Time TAA - 10 - 12 - 15 - 20 nS Chip Select Access Time TACS - 10 - 12 - 15 - 20 nS Output Enable to Output Valid TAOE - 5 - 6 - 7 - 10 nS Chip Selection to Output in Low Z TCLZ∗ 3 - 3 - 3 - 3 - nS Output Enable to Output in Low Z TOLZ∗ 0 - 0 - 0 - 0 - nS Chip Deselection to Output in High Z TCHZ∗ - 5 - 6 - 7 - 10 nS Output Disable to Output in High Z TOHZ∗ - 5 - 6 - 7 - 10 nS Output Hold from Address Change TOH 3 - 3 - 3 - 3 - nS ∗ These parameters are sampled but not 100% tested. Write Cycle PARAMETER SYM. W24257A-10 W24257A-12 W24257A-15 W24257A-20 MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX. UNIT Write Cycle Time TWC 10 - 12 - 15 - 20 - nS Chip Selection to End of Write TCW 9 - 10 - 13 - 17 - nS Address Valid to End of Write TAW 9 - 10 - 13 - 17 - nS Address Setup Time TAS 0 - 0 - 0 - 0 - nS Write Pulse Width TWP 9 - 10 - 10 - 12 - nS TWR 0 - 0 - 0 - 0 - nS Data Valid to End of Write TDW 6 - 7 - 9 - 10 - nS Data Hold from End of Write TDH 0 - 0 - 0 - 0 - nS Write to Output in High Z TWHZ∗ - 6 - 7 - 8 - 10 nS Output Disable to Output in High Z TOHZ∗ - 6 - 7 - 8 - 10 nS Output Active from End of Write TOW 0 - 0 - 0 - 0 - nS Write Recovery Time CS , WE ∗ These parameters are sampled but not 100% tested. -5- Publication Release Date: May 1997 Revision A14 W24257A TIMING WAVEFORMS Read Cycle 1 (Address Controlled) TRC Address TAA TOH TOH DOUT Read Cycle 2 (Chip Select Controlled) CS TACS DOUT TCHZ TCLZ Read Cycle 3 (Output Enable Controlled) T RC Address T AA OE T OH T AOE T OLZ CS T ACS DOUT T CHZ TCLZ -6- T OHZ W24257A Timing Waveforms, continued Write Cycle 1 (OE Clock) TWC Address T WR OE TCW CS T AW WE TWP TAS TOHZ (1, 4) D OUT T DW TDH D IN Write Cycle 2 (OE = VIL Fixed) T WC Address TWR TCW CS TAW WE T WP TAS TOH TWHZ (1, 4) DOUT TDW (2) (3) TOW TDH DIN Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured ±500 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested. -7- Publication Release Date: May 1997 Revision A14 W24257A ORDERING INFORMATION PART NO. W24257AK-10 W24257AK-12 W24257AK-15 W24257AK-20 W24257AJ-10 W24257AJ-12 W24257AJ-15 W24257AJ-20 W24257AS-10 W24257AS-12 W24257AS-15 W24257AS-20 W24257AQ-10 W24257AQ-12 W24257AQ-15 W24257AQ-20 ACCESS TIME (nS) 10 12 15 20 10 12 15 20 10 12 15 20 10 12 15 20 OPERATING CURRENT MAX. (mA) 170 160 150 140 170 160 150 140 170 160 150 140 170 160 150 140 STANDBY CURRENT MAX. (mA) 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 PACKAGE 300 mil skinny DIP 300 mil skinny DIP 300 mil skinny DIP 300 mil skinny DIP 300 mil SOJ 300 mil SOJ 300 mil SOJ 300 mil SOJ 330 mil SOP 330 mil SOP 330 mil SOP 330 mil SOP Standard type one TSOP Standard type one TSOP Standard type one TSOP Standard type one TSOP Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure. -8- W24257A PACKAGE DIMENSIONS 28-pin P-DIP Skinny Symbol A A1 A2 B B1 c D E E1 e1 L D 28 15 E1 1 14 a eA S Notes: E S A A2 A1 L c Base Plane Mounting Plane B e1 eA a B1 Dimension in Inches Dimension in mm Min. Nom. Max. Min. Nom. Max. 4.45 0.175 0.010 0.25 0.125 0.130 0.135 3.18 3.30 3.43 0.016 0.018 0.022 0.41 0.46 0.56 0.058 0.060 0.064 1.47 1.52 1.63 0.008 0.010 0.014 0.20 0.25 0.36 1.388 1.400 35.26 35.56 0.300 0.310 0.320 7.62 7.87 8.13 0.283 0.288 0.293 7.19 7.32 7.44 0.090 0.100 0.110 2.29 2.54 2.79 0.120 0.130 0.140 3.05 3.30 3.56 15° 0° 0.370 8.38 8.89 9.40 0° 0.330 0.350 15° 0.055 1.40 1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension E1 does not include interlead flash. 3. Dimensions D & E1 include mold mismatch and are determined at the mold parting line. 4. Dimension B1 does not include dambar protrusion/intrusion. 5. Controlling dimension: Inches. 6. General appearance spec. should be based on final visual inspection spec. 28-pin Small Outline J Band Symbol 28 A A1 A2 b1 b c D E e e1 HE L S y θ 15 E 1 HE 14 D c A2 s Seating Plane b b1 A L £c e A1 e1 y -9- Dimension in Inches Dimension in mm Min. Nom. Max. Min. Nom. Max. 3.56 0.140 0.027 0.69 0.095 0.100 0.105 2.41 2.54 2.67 0.026 0.028 0.032 0.66 0.71 0.81 0.016 0.018 0.022 0.41 0.46 0.56 0.008 0.010 0.014 0.20 0.25 0.36 0.710 0.730 18.03 18.54 0.295 0.300 0.305 7.49 7.62 7.75 0.044 0.050 0.056 1.12 1.27 1.42 0.245 0.265 0.285 6.22 6.73 7.24 0.327 0.337 0.347 8.31 8.56 8.81 0.077 0.087 0.097 1.96 2.21 2.46 0.045 1.14 0.10 0.004 0 10 0 10 Notes: 1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch and are determined at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec. should be based on final visual inspection spec. Publication Release Date: May 1997 Revision A14 W24257A Package Dimensions, continued 28-pin SO Wide Body Symbol 28 A A1 A2 b c D E e HE L LE S y θ 15 e1 E HE θ L Detail F 14 1 b Dimension in mm Dimension in Inches Min. Nom. Max. Min. Nom. Max. 2.85 0.112 0.004 0.10 0.093 0.098 0.103 2.36 2.49 2.62 0.014 0.016 0.020 0.36 0.41 0.51 0.008 0.010 0.014 0.20 0.25 0.36 0.713 0.733 18.11 18.62 0.326 0.331 0.336 8.28 8.41 8.53 0.044 0.050 0.056 1.12 1.27 1.42 0.453 0.465 0.477 11.51 11.81 12.12 0.028 0.036 0.044 0.71 0.91 1.12 0.059 0.067 0.075 1.50 1.70 1.91 0.047 1.19 0.004 0.10 10 0 10 0 Notes: 1. Dimensions D Max. & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimensions D & E include mold mismatch and are determined .at the mold parting line. 4. Controlling dimension: Inches. 5. General appearance spec should be based on final visual inspection spec. e1 D c 2 AA S e 1 y LE A See Detail F Seating Plane 28-pin Standard Type One TSOP Dimension in Inches Dimension in mm HD Symbol D c A A1 A2 b c D E e E b HD e L L1 Y θ θ A1 A2 A L L1 - 10 - Y Min. Nom. Max. Min. Nom. Max. 1.20 0.047 0.006 0.002 0.05 0.15 0.035 0.040 0.041 0.95 0.007 0.008 0.011 0.17 0.20 0.27 0.004 0.006 0.008 0.10 0.15 0.21 0.461 0.465 0.469 11.70 11.80 11.90 0.311 0.315 0.319 7.90 8.00 8.10 0.520 0.528 0.536 13.20 13.40 13.60 0.028 0.50 0.022 0.020 0.024 0 0.60 0.70 0.25 0.004 3 1.05 0.55 0.010 0.000 1.00 0 0.10 0.00 5 3 Note: Controlling dimension: Millimeters 5 W24257A Headquarters Winbond Electronics (H.K.) Ltd. No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5792647 http://www.winbond.com.tw/ Voice & Fax-on-demand: 886-2-7197006 Rm. 803, World Trade Square, Tower II, 123 Hoi Bun Rd., Kwun Tong, Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Winbond Electronics North America Corp. Winbond Memory Lab. Winbond Microelectronics Corp. Winbond Systems Lab. 2730 Orchard Parkway, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-9436668 Taipei Office 11F, No. 115, Sec. 3, Min-Sheng East Rd., Taipei, Taiwan TEL: 886-2-7190505 FAX: 886-2-7197502 Note: All data and specifications are subject to change without notice. - 11 - Publication Release Date: May 1997 Revision A14 ...
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This note was uploaded on 11/13/2011 for the course EEL 4744c taught by Professor Staff during the Fall '09 term at University of Florida.

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