Exam 2 Review Sheet
Know the different types of etching systems and the advantages and disadvantages of each.
This includes both wet (KOH, HF, BOE, HNA, etc) and dry etching systems (RIE,
plasma, DRIE, reverse sputtering, etc).
Be prepared to explain which method you would
use to etch common MEMS materials (such as silicon, silicon dioxide, and silicon
nitride) and why.
Know the important issues related to etching such as what determines: etch rate, anisotropy,
selectivity, and surface finish.
Understand the different types of etch stops.
Know the different types of thin film deposition systems (CVD, oxidation, diffusion,
sputtering, evaporation, etc.) and the advantages and disadvantages of each.
to explain which method you would use to deposit or grow common MEMS materials
Know the basic issues and fundamentals associated with X-ray Lithography including:
absorber, mask membrane, top, bottom, and critical doses, synchrotron radiation, etc.