Lab 08 Electroplating - Lab#7 Fabrication of Micromold...

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Lab#7 Fabrication of Micromold using Electroplating of Nickel 1 1. Check Lab Notebooks and Collect Project Assignments. 2. This lab has two parts, which are 1.Fabrication of mold using SU-8 and 2. Fabrication of metal micro mold using nickel electroplating. 3. You will use one wafer per batch. 4. Part#1 Fabrication of SU-8 Mold i. Remove SU-8 10 from the refrigerator for at least 2 hours before starting the process. ii. Start with polished silicon wafer with seed layer (500 o A,Chromium, 2000 o A Copper, 700 o A Chromium). iii. Remove top Chromium layer and do the cleaning process. (acetone/methanol) iv. Bake the silicon wafer at 200 o C for 5 minutes. v. Dispense 3 ml SU-8 10 on the wafer (3 inch) after placing the silicon wafer on the spinner. vi. Spin at (I) 200 rpm, 10 seconds and stop. (II) 1000 rpm, 30 seconds. This spin speed will provide ~ 25 μ m thickness. vii. Soft bake at 65 o C for 3 minutes and 90 o C for 7 minutes. viii. Place the wafer on 50 o C hot plate for 2 minutes and then allow it to cool to room temperature.
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