Lecture 13 Other Micromachining Techniques

Lecture 13 Other Micromachining Techniques - Emergencies...

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1 October 5, 2001 Nontraditional Microfabrication Techniques Dr. Bruce K. Gale Microsystems Principles ENGR 494C and 594C October 5, 2001 Microsystems Principles Emergencies October 5, 2001 Microsystems Principles Scaling of Tools October 5, 2001 Microsystems Principles Other Micromachining Techniques • Template replication • Sealed cavity formation • Surface modification •P r i n t i n g • Stereolithography (3-D) • Sharp tip formation • Chemical-mechanical polishing • Electric discharge machining • Precision mechanical machining • Thermomigration • Photosensitive glass • Focused ion beam • SCREAM October 5, 2001 Microsystems Principles Template Replication • Injection molding – Metal or silicon structures used as mold – Plastics, metal and ceramic components with plastic “binders” – Often done with LIGA or etching in silicon • Plating-based template replication (Electroforming) – Form mold or template – Plate into mold – Release structure • Ceramic slurry templates • Preformed, above substrate templates – Hollow microspheres October 5, 2001 Microsystems Principles CVD-based Template Replication (HEXSIL) • Structures made of
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2 October 5, 2001 Microsystems Principles HEXSIL Example Micro-Grippers Source: Berkeley October 5, 2001 Microsystems Principles Micro-Tweezers Source: MEMS Precision Instruments HEXSIL Example October 5, 2001 Microsystems Principles Sealed Cavity Formation • Form structure using sacrificial material and small access holes • Cover holes using one of three methods – Simple application of glues, plastics, photoresist, etc – Thin-film application such as sputtered, evaporated, and CVD films – Reactive sealing, i.e. thermal oxidation, etc • Gettering- collect gases in cavity October 5, 2001 Microsystems Principles S ingle C rystal R eactive E tching a nd M etalization CMOS compatible accelerometers Source: Maluf Source: Elwenspoek SCREAM October 5, 2001 Microsystems Principles Surface Modification • Used to change surface properties, especially in biomedical applications • HMDS used to “methylate” surface and remove hydroxyl groups • Self-assembled monolayers (SAMs) formed using RSiCl 3 (R is alkyl group) • Often used to reduce wear and adhesion forces • Apply dendrimers (hyper-branched polymers) for molecule recognition October 5, 2001 Microsystems Principles Printing • Useful for non-planar substrates • Very low-cost • Screen printing – Resolution limit of about 100 μ m – Alignment more difficult – Great for patterning polymer layers in biosensors – One step process – Requires liquid form • Transfer printing – Raised bumps used to transfer ink, etc • Powder loaded polymers – Material properties dependent on material in plastic liquid that can be rolled on and patterned •I
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This note was uploaded on 11/16/2011 for the course MSE 5960 taught by Professor Douglas during the Fall '04 term at University of Florida.

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Lecture 13 Other Micromachining Techniques - Emergencies...

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