Lecture 16a Bonding

Lecture 16a Bonding - Sacrificial Processes Materials...

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1 October 11, 2001 Bonding, Packaging, and Sacrificial Processes Dr. Bruce K. Gale Microsystems Principles ENGR 494C and 594C October 11, 2001 Microsystems Principles Sacrificial Processes • Materials – Photoresist – Silicon dioxide – Entire wafers – Metals – Glasses • Problems – Diffusion limits •G e om e t r y – Sticking • Phase change can eliminate •G e om e t r y October 11, 2001 Microsystems Principles Sacrificial Processes • Dissolved wafer processes – SOI wafers – Membranes – Moving structures • Sacrificial processes – Channels, cavities – Release moving structures •H EX S I L • Membranes • Cantilevers October 11, 2001 Microsystems Principles Bonding •W h
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Lecture 16a Bonding - Sacrificial Processes Materials...

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